· Innovative Image Acquisition Technology to Achieve Better Detection Capabilities
· Integrated 3D and 2D Metrology and Inspection in a Single System
· A Wide Selection of Sub-Micron Height Sensors from 2 Micron Gold and Micro Bumps to High Aspect Ratio TSV.
· Controllable and Independent Bright Field and Dark Field Detection Channels and Sophisticated Algorithms
· Enabling Best TPT/Sensitivity Envelop of Performance.
· Detects Dicing-Related Damage Inside and Outside Die Boundary at Unmatched Throughput.
· Automatic Defect Binning and Classification.
· Best-of-Breed Setup Automation to meet High Resolution and Productivity Requirements of Pure-Play Packaging Houses
Handling Hundreds of Products.