Wire Bonding
CWI represents companies with leading wire bonding solutions for Univerisities, R&D, and small to large companies. Whether you are searching for
a manual, semi-automated, or fully-automated bonder with applications in need of Ball, Wedge, or Bump Bonding, which can support standard wire
sizes to heavy wire of varying materials, the leading companies we represent have the solutions.
Fully-Automated
Manual
Semi-Automated
           
Front End
Metrology/Inspection
Back End
Test & Measurement
Failure Analysis
Automation
CWI Technical Sales    Phone: 732-536-3964     Fax: 732-536-0495    
TPT:
Manual Wire Bonder
TPT:
Semi-Automated Wire Bonder
TPT:
Semi-Automated Heavy Wire Bonder
Hesse Mechatronics:
Fully-Automated
Fine Wire Bonder
Hesse Mechatronics:
Fully-Automated
Heavy Wire Bonder
Hesse Mechatronics:
Fully-Automated
Heavy Wire Bonder