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Automated Optical Inspection.
Bump Inspection.
Dicing Defect Inspection.
Probe Mark Inspection.
Defect Inspection.
MEMs Inspection.
Cover Glass Inspection. |
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Die Bonding Systems.
Manual.
Semi-Automated.
1um Alignment Accuracy.
Flip Chip.
Eutectic.
Epoxy Bonding.
ACF.
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Multifunctional Bond Testers.
Pull, Shear Test Unit.
Automatic selection of Pull Tools, Shear Tools and measurement sensors by using a Revolving Measurement Unit.
Measuring of X, Y and Z travel for pull, push or shear distance.
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Thermal Test Solutions.
ThermoStreams.
-90 to +225C.
Benchtest. Automation.
Integrated Chamber.
Portability.
ThermoChucks.
-65 to +300C.
Probe Station Integration.
Low Noise.
ThermoChambers.
Accelerated and Accurate Temperature Transitioning.
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Device Modeling.
PHEMT, MESFET, HBT.
Compound Semi.
Instrumentation.
Load Pull Systems.
Noise Figure Systems.
Pulsed IV Systems.
Electronic Tuners.
Automated Test Systems.
TR Module Test.
LDMOS Module Test.
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Package Test, Inspection and Automaton Solutions.
High Speed Rotary Handlers.
Gravity Fed Handlers.
Pick and Place Handlers.
High Speed Pkg Inspection.
LED Burn In Systems.
LED Package Test.
Advanced Inspection Software.
Custom Automation Solutions. |
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Fully integrated RF accelerated life-test/burn-in test systems for compound semiconductor devices which are used in the iimplementation of broadband wireless infrastructures and networks |
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Test Contactors.
DC to 40GHz.
QFNs, QFPs, SOs.
Center Body Grounding.
Lead-Free Solutions.
Manual Test.
Automated Handler Test.
Easy to maintain.
High MTBA.
High throughput.
Consistant Results.
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Testhead Manipulators.
Up to 1300kg.
Modular Design.
Accurately Repeatable Positioning.
Active Cable Management.
Docking Hardware.
Carts and Trolleys.
Politan.
Wear Resistant Materials. |
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High Performance Probe Cards.
-65 to +300C
Low Current.
Low Voltage.
Crash Resistant.
Ceramic Technology
Single Site.
Multi-Site.
Full Wafer.
Positioner Mount.
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ESD Testing Solutions.
HBM, MM.
Up to 2016 Pins.
Up to 12kV.
Integrated Probe Stations.
Wafer Level Test.
Package Level Test.
Latch Up Solutions.
Trigger Pulse per JEDEC 78.
30ns Risetime.
Durations from 1ns to 2sec.
40ns Fall Time.
Power Supply Sequencing.
User selectable time interval.
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Custom Automated Package Test Handlers.
Pick and Place.
Rotary Style.
Cabled in testing or Testhead Docking available.
Tape and Reel Integration.
Inspection.
Laser Marker Integration.
Pulsed IV Systems.
Electronic Tuners.
Automated Test Systems.
TR Module Test.
LDMOS Module Test.
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Advanced Probe Card Solutions.
Vertical.
High Frequency.
Fine Pitch.
Multi-Die.
BGA Probing.
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