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Ultra-High Resolution 3D X-Ray Tomography.
Fluorescence Imaging Systems.
Sub-micron Resolution Systems with short exposure times.
30nm Feature Detection Systems.
Semiconductor.
Advanced Materials.
Nanotechnology.
Biotech.
Life Sciences. |
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Probe Stations.
Educational. Manual.
Semi and Fully-Automated.
Ultra-Low Noise.
High Frequency.
Reliability.
Failure Analysis.
Optical.
Vacuum/Cryogenic.
DC and RF Probes.
Advanced Software. |
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ESD Testing Solutions.
HBM, MM.
Up to 2016 Pins.
Up to 12kV.
Integrated Probe Stations.
Wafer Level Test.
Package Level Test.
Latch Up Solutions.
Trigger Pulse per JEDEC 78.
30ns Risetime.
Durations from 1ns to 2sec.
40ns Fall Time.
Power Supply Sequencing.
User selectable time interval.
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Thermal Test Solutions.
ThermoStreams.
-90 to +225C.
Benchtest. Automation.
Integrated Chamber.
Portability.
ThermoChucks.
-65 to +300C.
Probe Station Integration.
Low Noise.
ThermoChambers.
Accelerated and Accurate Temperature Transitioning.
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Fully integrated RF accelerated life-test/burn-in test systems for compound semiconductor devices which are used in the iimplementation of broadband wireless infrastructures and networks |
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Test Contactors.
DC to 40GHz.
QFNs, QFPs, SOs.
Center Body Grounding.
Lead-Free Solutions.
Manual Test.
Automated Handler Test.
Easy to maintain.
High MTBA.
High throughput.
Consistant Results.
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Photo (EMMI) emission.
Thermal emission.
Thermal (OBIRCH) and photoelectrical (OBIC) laser stimulation systems.
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