|
 |
 |
|
 |
 |
|
|
|
|
|
 |
|
|
 |
Fully integrated RF accelerated life-test/burn-in test systems for compound semiconductor devices which are used in the iimplementation of broadband wireless infrastructures and networks |
|
|
|
|
|
 |
 |
|
|
|
|
 |
Package Test, Inspection and Automaton Solutions.
High Speed Rotary Handlers.
Gravity Fed Handlers.
Pick and Place Handlers.
High Speed Pkg Inspection.
LED Burn In Systems.
LED Package Test.
Advanced Inspection Software.
Custom Automation Solutions. |
|
|
|
|
 |
|
|
 |
Device Modeling.
PHEMT, MESFET, HBT.
Compound Semi.
Instrumentation.
Load Pull Systems. Noise Figure Systems.
Pulsed IV Systems.
Electronic Tuners.
Automated Test Systems.
TR Module Test.
LDMOS Module Test.
|
|
|
|
|
 |
|
|
 |
Test Contactors.
DC to 40GHz.
QFNs, QFPs, SOs.
Center Body Grounding.
Lead-Free Solutions.
Manual Test.
Automated Handler Test.
Easy to maintain.
High MTBA.
High throughput.
Consistant Results.
|
|
|
|
|
 |
|
|
 |
High Performance Probe Cards.
-65 to +300C
Low Current.
Low Voltage.
Crash Resistant.
Ceramic Technology
Single Site.
Multi-Site.
Full Wafer.
Positioner Mount.
|
|
|
|
|
 |
|
|
 |
Thermal Test Solutions.
ThermoStreams.
-90 to +225C.
Benchtest. Automation.
Integrated Chamber.
Portability.
ThermoChucks.
-65 to +300C.
Probe Station Integration.
Low Noise.
ThermoChambers.
Accelerated and Accurate Temperature Transitioning.
|
|
|
|
|
 |
|
|
 |
Testhead Manipulators.
Up to 1300kg.
Modular Design.
Accurately Repeatable Positioning.
Active Cable Management.
Docking Hardware.
Carts and Trolleys.
Politan.
Wear Resistant Materials. |
|
|
|
|
 |
|
|
 |
Advanced Probe Card Solutions.
Vertical.
High Frequency.
Fine Pitch.
Multi-Die.
BGA Probing.
|
|
|
|
|
 |
|
|
 |
ESD Testing Solutions.
HBM, MM.
Up to 2016 Pins.
Up to 12kV.
Integrated Probe Stations.
Wafer Level Test.
Package Level Test.
Latch Up Solutions.
Trigger Pulse per JEDEC 78.
30ns Risetime.
Durations from 1ns to 2sec.
40ns Fall Time.
Power Supply Sequencing.
User selectable time interval.
|
|
|
|
|
 |
|
|
 |
Custom Automated Package Test Handlers.
Pick and Place.
Rotary Style.
Cabled in testing or Testhead Docking available.
Tape and Reel Integration.
Inspection.
Laser Marker Integration.
Pulsed IV Systems.
Electronic Tuners.
Automated Test Systems.
TR Module Test.
LDMOS Module Test.
|
|
|
|
|
|