Backend > Underfill Curing / De-voiding

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Void Free System (VFS)

The VFS (Void Free System) is a pressure curing oven that eliminates voids in FOW (Film Over Wire), DAP (Die Attach Pad), DAF (Die Attach Film), TIM (Thermal Interface Material), RCBGA, and CUF (Capillary Underfill).

Void Terminator System (VTS)

The VTS (Void Terminator System) is an enhanced pressure curing oven that terminates voids in underfill for Fine Pitch CUF, 3DIC, 2.5D, DAP, DAF, NCF, NCP and CUF (Capillary Underfill).

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Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

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704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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