Backend > Dicing 

DICING SAWS

7120 & 7130 Series

2" and 4" Spindle Dicing Systems

Applications:

  • Ceramic Substrates

  • Thick-film Devices

  • Glass

  • Glass on Silicon (sensors)

  • PZT

  • SAW Filters

  • MEMS

  • LED & LED Packages

  • Package Singulation (BGA, QFN, LTCC)

  • Opto-electronic Components

  • IC Wafers

Features and Options:

  • Extra large area dicing (7100 XLA)

  • Large area

  • Tilting Spindle

  • Dressing Station for diamonds exposure and clogging prevention

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Advantages:

  • Full range of automatic vision capabilities

  • Advanced hardware platform for high reliability and low maintenance

  • Heavy Duty, cast-iron base structure for superior precision and accuracy

  • Increased yield, throughput and process control

  • Unique multi-panel processing capabilities

  • Special blade wear forecast algorithm

  • User-friendly software platform

7220 Series

Fully Automatic Dicing Systems

With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation.

Applications:

  • Silicon

  • Glass on silicon

  • MEMS

  • GaAs wafers

  • Package Singulation (BGA & QFN)

  • LTCC

  • PCB

  • Hard materials

The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.

Advantages:

  • Full range of automatic vision capabilities

  • Advanced hardware platform for high reliability and low maintenance

  • Heavy Duty, cast-iron base structure for superior precision and accuracy

  • Increased yield, throughput and process control

  • Unique multi-panel processing capabilities

  • Special blade wear forecast algorithm

  • User-friendly software platform

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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