Backend & Metrology > Warpage Metrology

akrometrix logo.png

PRODUCTS

AXP 2.0

A modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm.

A metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm.

PS600S

A modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 600 mm x 600 mm.

AKM600P

Perfect for the Fan Out Wafer Level Packaging Market (FOWLP), the AKM600P is a bridge tool – allowing companies the flexibility to measure wafers of any size and panels (up to 600mm x 600mm) on the same platform without any changing out of fixtures, etc.

TTSM

The TTSM (Table Top Shadow Moiré) Metrology System provides ultra fast surface topography for substrates up to 330mm x 330mm.

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

© 2023 by Dr. Repair. Proudly created with Wix.com