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AUTOMOTIVE SOLUTIONS
(under construction)
Die Bonding
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Manual Die Bonders
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Semi-Automated Die Bonders
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Fully-Automated Die Bonders
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Flip Chip Bonders
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Thermosonic Die Bonding
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Thermocompression Die Bonding
Wire Bonding
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Manual, Semi-Auto and Fully-Automated Wire Bonders
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Ball or Wedge Bonding
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Fine or Heavy Wire Bonding
Bond Testing
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Die Shear, Wire Pull, Adhesion, Ball Pull, etc.
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Revolving Measurement Unit
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Automation
Reflow/Soldering
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Fluxless solder reflow
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Flux based reflow
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Batch and In-line Reflow Systems
Sintering
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Up to 200t Pressure
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Controlled atmosphere
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Up to 350C
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Modular System
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Direct to Copper Sintering
Pressure Curing Oven (PCO)/Autoclave
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2.5D and 3D Underfill Void Removal
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NCP/CUF/DAF/FOW Curing
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Die Attach Curing
Sorting
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High Speed or High Flexibility Die Sorting
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From Wafer Frame, Waffle or Gel Packs
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To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk
Automated Optical Inspection
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Wafers, Modules, or Substrates
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2D or 3D AOI
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Bump/Pillar, EPI, Dicing Inspection
Vacuum Drying
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max 200C
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Heating: Hot water, Thermal Oil, Electric
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Shelf Area: 1 to 20m2
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High-Grade Stainless Steel
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Soldering Fixtures
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Base Plates, Coolers, Pin Fin, Spacers
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Heat Sinks
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Components for Diodes/Thyristors
Aluminum Graphite Fixtures/Base Plates
Laser Trimming and Test Systems
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Thin and Thin Film Trimming
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Unique, proprietary flying probe technology
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High Reliability Fiber Laser or DPSSL
Laser Drilling
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Single or Dual Laser
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High performance beam positioning
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Blind Via and Through Via Drilling, Routing, Patterning, Defect Repair