BACKEND SOLUTIONS

Plasma Cleaning
  • Cleaning

  • Descum

  • Adhesion

Plasma Cleaning

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  • Manual

  • Semi-Automated

  • Fully-Automated

Die Bonding

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  • Manual, Semi-Auto and Fully-Automated

  • Ball or Wedge Bonding

  • Fine or Heavy Wire

Wire Bonding

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  • Die Shear, Wire Pull, Adhesion, Ball Pull, etc.

  • Revolving Measurement Unit

  • Automation

Bond Testing

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  • Fluxless soldering

  • Flux based attach

  • Batch and In-line

Reflow/Soldering

  • Up to 200t Pressure

  • Controlled atmosphere

  • Up to 350C

  • Modular System

  • Direct to Copper

Sintering

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  • 2.5D and 3D

  • NCP/CUF/DAF/FOW

  • Warpage Control

Underfill Curing/

De-Voiding

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  • Laser or Saw

  • Up to 12"

  • Wafers, Packages or Materials

Dicing

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  • High Speed or High Flexibility

  • From Wafer Frame, Waffle or Gel Packs

  • To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

Sorting

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  • Wafers, Modules, or Substrates 

  • 2D or 3D

  • Bump/Pillar, EPI, Dicing

Automated Optical Inspection

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  • -55 to +300C

  • 600 x 600mm

  • Sub-micron warpage and strain metrology

Warpage Metrology

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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