Metrology > Automated Optical Inspection

Backend & Metrology > Automated Optical Inspection

Automated Optical Inspection

 

CAMTEK

Whole & Diced Substrate Inspection

Eagle-i

The most advanced system for 2D surface defect inspection and metrology

High volume production 2D inspection solutions for:

  • Pre & post bumped wafers

  • Probe Mark Inspection

  • OQC

  • Post dicing

  • Reconstructed Wafers

Unique solutions for:

  • CMOS Image Sensor -Advanced solutions for the smallest pixels

  • MEMS - Meeting your special application requirements

  • LED - Yield improvement solutions

Eagle-T

Higher Resolution, Faster Speed

Leading 2D inspection capabilities empowered by:

  • Genesis detection engine

  • New camera

  • New high-end optic channel

  • Special LED illumination

  • CAD based detection

  • Cutting edge processing power

Advanced solutions for Fan-out applications:

  • Down to 2µm RDL inspection

  • Panel handling

  • Warped wafer handling

Bump & Pillar Inspection

Eagle-AP

Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels

  • Next generation bumps down to 2µm

  • Ultra high number of bumps measurement per wafer (50 million)

  • Bump CD and surface detection

  • RDL CD and height measurement

  • TSV post-via-fill protrusions (nails)

EagleT-AP

Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels

Leading inspection and metrology capabilities empowered by:

  • Genesis detection engine

  • New camera

  • New high-end optic channel

  • Special LED illumination

  • CAD based detection

  • Cutting edge processing power

  • Next generation bumps down to 2µm

  • Ultra high number of bumps measurement per wafer (50 million)

  • Bump CD and surface detection

  • RDL CD and height measurement

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Modules, PCB and Wire

MVP 850G

Die and Wire Bond Inspection

Key Features:

  • Die Placement Metrology

  • Die Surface, Edge Crack Detection

  • Epoxy Spread and Flow Measurement

  • Au, Al, Ag, and Cu Wires to 1um Resolution

  • Wedge, Ball, and Stitch Wire Bonds

  • Crescent, and Tape Bonds

  • SMT Components

Options:

  • Single or Dual Lane Operation

  • Optional 3D Epoxy Height Measurement

  • AutoWidth

  • Multiple Handling Solutions

  • Custom Handling Solutions

Spectra Series II

35" x 35" (890mm x 890mm) Backplane and Large Board AOI

Key Features:

  • SMT, Confocal and SPI capable

  • 35” x 35” (890mm x 890mm) Standard Inspection Area

  • 5 MP/8MP/12MP Color Camera

  • Patriot Plus Quad Lighting

  • Standard 10um pixel resolution

  • Tri-Linear & 0.5 microns encoders

Options:

  • 35” X 40” (890mm x 1016mm)Inspection Area (XL)

  • Z-Axis Camera Lift

  • Dual Lane

  • Board Indexing

Ultra V

High Volume and High Performance SMT AOI

Key Features:

  • Standard 10um pixel resolution

  • 01005 Ready

  • Fast Programming Generation using ePro and Validate

  • Lowest False Call Rates

  • High Throughput to 14 Sq Inches per second.

  • Highest Defect Detection using Quad Color Technology

  • Dual linear axis and 0.5 micron linear encoders

Options:

  • Z-axis Camera Lift

  • Autowidth

  • 3 Stage Conveyor

  • Dual Lane

  • Top Side Reference Board Lifter

  • Flexible Configurable for 3D Laser option

  • XL option provides 20” x 30” board size

 
 

MACHINE VISION PRODUCTS

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Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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