Backend > Wire Bonding

Wire Bonding

TPT WIRE BONDER

 
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Manual

HB05

 

Bench Top Size Wire Bonder

  • Ideal for laboratories and pilot production lines

  • Wedge, Ball, Bump and Ribbon bonding

  • 17µ to 75µ Wire & 25µ x 250µ Ribbon

  • 4'3" TFT Display & Multi Button

  • Deep-Access Wedge 16mm / Ball 13mm

  • Bond Arm Length is 165mm

  • Motorized Tail Control

  • 20 Program Storage Capacities

  • Electronic Ball Size Control

  • Pick & Place Option

  • Pull Tester Option

Semi-Auto

HB10

 

Wire Bonder with Automatic Z-Axis

  • Wedge, Ball, Bump and Ribbon bonding

  • 17µ to 75µ Wire & 25µ x 250µ Ribbon

  • 6'5" TFT Touch Screen

  • Deep-Access Wedge 16mm / Ball 13mm

  • Bond Arm Length is 165mm

  • Motorized Z-Axis

  • 100 Program Storage Capacities

  • USB Backup

  • Electronic Ball Size Control

  • Pick & Place Option

  • Pull Tester Option

  • Copper Bonding Option

HB16

 

Wire Bonder with Motorized Z- and Y-Axis

  • Wedge, Ball, Bump and Ribbon bonding

  • 17µ to 75µ Wire & 25µ x 250µ Ribbon

  • 6'5" TFT Touch Screen

  • Deep-Access Wedge 16mm / Ball 13mm

  • Bond Arm Length is 165mm

  • Motorized Z- & Y-Axis

  • 100 Program Storage Capacities

  • Programmable Loop Profile

  • USB Backup

  • Electronic Ball Size Control

  • Pick & Place Option

  • Pull Tester Option

  • Copper Bonding Option

Semi-Auto, Heavy Wire

HB30

 

Motorized Z- & Y-Axis

  • Aluminum & Copper Wedge Bonding

  • 100um to 500um Wire

  • Ribbon size up to 300x2000um

  • Repeatable Loop Profiles

  • Touch Screen Interface

  • Automatic Bond Height Adjustment

  • Deep and Wide Bond Access with Large Working Area

  • Simple Loop Programming

  • 100 parameter Storage

  • High precision cutting sequence

  • Vacuum Stage Fixation

Fully-Auto, Low Volume

HB100

 

Motorized Z- X- Y-Axis Bondhead Rotation

  • Wedge and Ball Bonding with One Bond Head

  • Touch Screen Interface with 21" and Joystick Controller

  • Linear Motor Axis System

  • Deep and Wide Bond Access with Large Working Area

  • Bond Wire from 17µm to 75 µm

  • 17µ to 75µ Wire & 25µ x 250µ Ribbon

  • Dual Camera System

  • Crash Prevention System for Z-Axis Touch Down

  • Broad Rand of Accessories like Heater Stages & Top Plates

 
 
 
 

ASM

Fully-Auto High Speed Ball Bonder

Eagle AERO

 

For High-End IC Applications

  • Up to 30% higher in UPH

    • for a typical Cu wire application​

  • 22µm bonded ball size

    • expertly engineered to reduce ball size to 22µm with 0.5mil wire

  • Application ready up to 30µm

  • Dimensions: 1,200 W x 990 D x 1,760mm³ H

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