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High Frequency / mmWave
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0.35mm Min Pitch

>100GHz @ -1dB Insertion Loss

>100GHz @ -10dB Return Loss

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Conventional RF socket design that doesn't require shielding.  Easy socket and pin maintenance. Longer lifespan compared to elastomer contact.

Coaxial
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0.40 Min Pitch

<500 Pin Count

BGA

-40 to +125C

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Relaible solution based upon accurate simulation, considerate design and precise machining.  Coaxial socket can achieve high reliability and longer life.

16 site WLCSP Probe Heads
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0.35mm Min Pitch

>1000 Pin Count

WLCSP

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Ideal for Wafer Level Testing and Cost Effective Test Solution.  With assured high performance for a number of applications, our probe heads are quality investment for achieving high bandwidth, low contact resistance, longer life and high reliability.

WLCSP Probe Head
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0.15mm Min Pitch

>5000 Pin Count

WLCSP

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With assured high performance for a number of applications, our probe heads are a quality investment for achieving high bandwidth, low contact resistance, longer life and high reliability.

High Pin Count Sockets
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0.9mm Min Pitch

Up to 10,000 Pin Count

BGA

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The major challenge of a big package with high pin counts is warpage.  TTS is able to custom make a Pin & Socket by simulation for optimum design to overcome co-planarity variation for stable contact to prevent intermittent contact failure.

Probe Pins

2mm Short Pin
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0.40mm Min Pitch

2mm Length

LGA, QFN, etc.

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High Frequency Short Pin
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0.35mm Min Pitch

98.90GHz Bandwidth @ -1dB

0.29nH Self Inductance

Kelvin Pin
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0.40mm Min Pitch

3.20mm Test Height

QFN

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High Power Pin
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0.80mm Min Pitch

6.5A Current Rating

<20mOhm Contact Resistance

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