Front End > Laser Solutions

LASER SOLUTIONS

Marking

Wafer Back Side Marker

CSM2000 / 3000

The CSM series is a semiconductor chip scale wafer level marker that marks the backside of the wafer without chip damage.​

Wafer Top Side Marker

WTM200 / 300

The WTM series is a device for marking the wafer with reference die, bad die, wafer ID. Provides wafer top side marking solution that can be processed at a high speed.

Wafer ID Marker

WM080 / 012​

The WM series is a wafer ID marking system that is only available in the classroom-level cleanroom. It ensures high stability and high speed machining.

Grooving & Dicing

LMC3200

​The LMC3200G uses a DPSS laser to remove low-k and metal layers which cause yield reduction in blade saw process. Significantly improves quality and productivity of the singulation process.

Laser Debonding

Laser Debonder

​The Laser Debonding system uses a Nanosecond UV Laser with a Flat Top Beam Mode.

Modular System with Cleaning, Flipping and Picking Modules.

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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