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Coaters & Developers

 

PHOTORESIST : S-CUBED

 

DRY PHOTORESIST : MICROCONTROL

  • High volume production photoresist processing for up to 300mm wafers

  • Completely programmable with lowest COO in the industry

  • FOUP, FOSB or Cassettes

  • Up to 4 photoresist dispensers standard

With the introduction of the SCENE 12-MAX™, S-Cubed has taken the SCENE 12 architecture to its fullest potential with more stacked processes, their most advanced robotics, higher reliability and the lowest overall cost of ownership of any similar wafer processing tool, while keeping overall footprint low.

  • Lowest cost of ownership, high volume photoresist processing of wafers up to 200mm

  • High speed handling and programmable wafer centering

  • Designed for production use with a focus on reliability and throughput

  • Low footprint production photoresist with radial robot access and stacked modules for up to 200mm wafers

  • Spin Axis is always within one revolution in absolute terms of programmed velocity and trajectory

  • This Wafer Edge Processing System is the most flexible and configurable solution in the world

  • Provides concentricity within .75mm, handling wafer sizes to 300mm, with flat following & patterns

  • FOUP, FOSB or Cassettes

  • Up to 4 photoresist dispensers standard

  • Back side reticle cleaner (patent pending)

  • Mask handling is only at points on the edge

  • Pellicle does not need to be removed

  • Clears haze, removes organic and particulate contamination

  • Self contained Class I environment when used with SMIF pod

BG & Temporary Bonding Film Lamination

Taper and Detaper System

  • Lowest cost of ownership through 'total gap control'

  • Wafer size up to 8"

  • Highest throughput: Process linked - avg. 55 wfrs/hr

  • Ultra thin wafers processing using zero force lamination technology

  • Ultra thin wafer detaping with special chuck

Taper and Detaper System

  • Lowest cost of ownership through 'total gap control'

  • Wafer size 8 - 12"

  • Throughput: Process linked - avg. 50 wfrs/hr

  • Ultra thin wafers processing using zero force lamination technology

  • Ultra thin wafer detaping with special chuck

Dry Metal Lift Off

Metal Lift Off System

  • Wafer size: 150 - 200 mm

  • New method to lift off metal with adhesive tape from wafer

  • Allows customer to choose solvent free process

  • Even using solvent there is no need to destroy metal layer to reach photoresist

  • Easier and more environmental friendly method to recycle precious metal waster

DIE Attach Film Lamination

Laminator and Mylar Removal System

  • Wafer size up to 8"

  • Lowest tape consumption

  • Controlled lamination speed and pressure

  • Controlled roller temperature

  • Controlled chuck temperature

  • Throughput: process linked - average 20 wfrs/h

  • Centering/Alignment: Contactless/Optical System

Photopolymer Film Lamination

Photopolymer Film Lamination & Cover Sheet Removal Systems​

  • Used for BUMPING, WLP and MEMS

  • Up to 8"

  • Low tape consumption

  • Controlled lamination speed and pressure

  • Controlled roller temperature

  • Controlled chuck temperature

Photopolymer Film Lamination & Cover Sheet Removal Systems​

  • Used for BUMPING, WLP and MEMS

  • 8" & 12"

  • Low tape consumption

  • Controlled lamination speed and pressure

  • Controlled roller temperature

  • Controlled chuck temperature

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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