Vacuum-Supported Soldering Process That Provides Void-Free Solder Connections
Batch Soldering System Under Vacuum
The VADU 200XL soldering unit is a batch system, designed for both paste and preform soldering. With its two hermetically separated process chambers the system provides precise control of all relevant process parameters, such as temperature gradients during heating and cooling.
Soldering of Substrates and Wafers in Mass Production
Equipped with two separate process chambers this system is designed for both paste and preform soldering. It allows soldering of wafers up to 12 inches.
Efficient Soldering System for Series Production
Designed for high efficient series production with three separate process chambers, internal substrate handling and inline carrier transfer. According to customer requirements the loading or reloading operations can be realized manually or automatically.
Sinter Technology for Reliable and Temperature-Resistant Sintered Connections
From the Sintering Module SIN200 up to the Optionally Expandable Complete System SIN200+
A highly flexible sintering system that is suitable for a wide range of production requirements from the laboratory to series production. It has a modular design that allows it to operate as a batch system or automated inline system with different preheating and/or cooling modules.