Metrology > X-Ray Metrology

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TXRF TOOLS

TXRF 3800e
  • Accepts up to 200 mm wafers

  • Measures elements from S through U with a single-target, dual-beam X-ray system and a new liquid nitrogen-free detector system

  • Features ease of operation, rapid analysis results, low cost of ownership and more

TXRF 3760
  • Accepts up to 200 mm wafers

  • Measures elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system

  • Features a high power rotating-anode source, ease of operation, rapid analysis results and more

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TXRF 310Fab
  • Accepts 300 mm, 200 mm, and 150 mm wafers

  • Measures elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system

  • Features quick contamination inspection for semiconductor processes, a wide range of analytical elements (Na~U) and more

TXRF-V310
  • Accepts 300 mm, 200 mm, and 150 mm wafers

  • Measures elements from Na through U with a single-target, 3-beam X-ray system and a liquid nitrogen-free detector system

  • Features single target 3-beam method and unique XYθ stage, enabling highly accurate ultra trace analysis over entire wafer surface

XRF TOOLS

 
WaferX 310
  • In-line, simultaneous WDXRF spectrometer for wafer metal film metrology

  • Accepts up to 300 mm wafers

  • Ideal for measuring BPSG, PSG and metal films

  • Capable of high analytical performance, accuracy, and stability

  • Patented "diffraction avoidance" capability

WDA-3650
  • Simultaneous evaluation of film thickness and composition

  • Accepts up to 200 mm and media disks

  • Contributes significantly to process control of metal film thickness, film composition, and element concentration, with new functions and a low-COO design

AZX400
  • Sequential WDXRF spectrometer for elemental analysis and thin-film metrology of large and/or heavy samples

  • Large sample analysis up to 400 mm (diameter), 50 mm (thickness), 30 kg (mass)

  • Ideal for analyzing sputtering targets, magnetic disks, or for multilayer film metrology on Si wafers

 

COMBO TOOLS

MFM310
  • Process XRR, XRF, and XRD metrology tool featuring X-ray beams and pattern recognition

  • For 200 mm and 300 mm wafers

  • High-throughput, product-wafer measurements

  • High resolution and precision, covering thicknesses from angstroms to microns

  • CE Marking and S2/S8 Compliance

CALL US

Tel: 732-536-3964

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OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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