Failure Analysis > Micro Cleaving

PRODUCTS

The MC600i system utilizes Micro Cleaving and Precise Cleaving technologies in two main processes - full process and fast process.

System Highlights

  • Turn-around time drastically reduced

  • Improves yield analysis and characterization

  • improves and enhances SEM imaging

  • High productivity

  • Low cost of ownership

MC10

Contact us for information on this product.

Perfect Cleave Mechanism (PCM) is a simple manual cleaving tool for cross-section of crystalline materials such as Si, GaN, GaAs, InPh, SiC and others.

System Highlights

  • Perfect quality of cross-section

  • High throughput

  • Improves and enhances SEM imaging

  • Compact size

  • Low cost of ownership

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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