Backend & Metrology > Warpage Metrology

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PRODUCTS

AXP 2.0
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A modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm.

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A metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm.

PS600S
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A modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 600 mm x 600 mm.

AKM600P
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Perfect for the Fan Out Wafer Level Packaging Market (FOWLP), the AKM600P is a bridge tool – allowing companies the flexibility to measure wafers of any size and panels (up to 600mm x 600mm) on the same platform without any changing out of fixtures, etc.

TTSM
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The TTSM (Table Top Shadow Moiré) Metrology System provides ultra fast surface topography for substrates up to 330mm x 330mm.