Backend > Bond Testing

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Condor Sigma

The Most Advanced Bond Tester on the Market, Featuring Performance & Flexibility

  • Revolving Measurement Unit (RMU)

  • 0.1gf to 200kgf

  • Pull, shear, bend, peel, torque

  • 0.075% Accuracy

Condor Sigma W12

Fully Integrated Solution for Automated Wafer Testing (Up to 300 MM)

  • Revolving Measurement Unit (RMU)

  • Automated up to 300 mm

  • Cold bump pull, shear

  • Debris cleaner

Condor Sigma Lite

A Bond Tester That Can Grow 

Within Your Company

  • Revolving Measurement Unit (RMU)

  • 0.1gf to 200kgf

  • Pull, shear, bend, peel, torque

  • 0.075% Accuracy

Condor Sigma XL

(Extra) Large Area Bond Tester

  • Revolving Measurement Unit (RMU)

  • 500 mm in X and 800 mm in Y

  • 2.5gf to 1000kgf

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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