Unique puck controlled air bearing stage for
quick single-handed operation

Rigid platen accommodates up to 10 DC or 4 RF positioners

Highly repeatable platen lift design with three discrete positions

Design for Advanced EMI / RFI / Light-Tight Shielding

FemtoAmp low-leakage capabilities

Integrated active vibration isolation

Ready for temperature range -60 °C to 300 °C

Seamless integration of any banded, differential or broadband frequency extenders and automated impedance tuners

Novel design of extenders/tuners integration for maximum of measurement dynamic

Unique puck controlled air bearing stage for quick single-handed operation

Rigid platen accommodates up to 10 high voltage or 4 high current positioners

Designed with easy single wafer front load

Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder

Device Modeling - DC-IV / DC-CV / Pulse-IV

RF and mmW - RF from 26 GHz to 110 GHz

FA - Probe card / Internode Probing

WLR - Hot/Cold/Long-term test

MPI IceFreeEnvironment™ for using MicroPositioners and probe cards simultaneously, even at negative temp

Programmable microscope movements for more automation and ease of use

The shortest cable interface to IC tester

Minimize the platen-to-chuck distance for mmW & probing with active probes

Supports film-frame probing

On wafer high power device measurement up to 10kV/600A

Gold plated chuck surface for minimum contact resistance and vacuum holes for thin wafer handling down to 50 μm

Taiko wafer chuck option

Dedicated high voltage and high current probes

Anti-arcing solutions