200mm Probe Stations
MANUAL SYSTEMS
TS200
Standard Configuration
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Unique puck controlled air bearing stage for
quick single-handed operation -
Rigid platen accommodates up to 10 DC or 4 RF positioners
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Highly repeatable platen lift design with three discrete positions
TS200-SE
DC/CV, RF and mmWave
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Design for Advanced EMI / RFI / Light-Tight Shielding
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FemtoAmp low-leakage capabilities
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Integrated active vibration isolation
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Ready for temperature range -60 °C to 300 °C
TS200-THZ

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Seamless integration of any banded, differential or broadband frequency extenders and automated impedance tuners
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Novel design of extenders/tuners integration for maximum of measurement dynamic
mmWave and sub-mmWave
TS200-HP

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Unique puck controlled air bearing stage for quick single-handed operation
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Rigid platen accommodates up to 10 high voltage or 4 high current positioners
High Power up to 10kV, 600A
AUTOMATED SYSTEMS
TS2000
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Designed with easy single wafer front load
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Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder
Standard Configuration
TS2000-SE
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Device Modeling - DC-IV / DC-CV / Pulse-IV
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RF and mmW - RF from 26 GHz to 110 GHz
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FA - Probe card / Internode Probing
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WLR - Hot/Cold/Long-term test
DC/CV, RF and mmWave
TS2000-IFE
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MPI IceFreeEnvironment™ for using MicroPositioners and probe cards simultaneously, even at negative temp
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Programmable microscope movements for more automation and ease of use
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The shortest cable interface to IC tester
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Minimize the platen-to-chuck distance for mmW & probing with active probes
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Supports film-frame probing
Flexible and Expandable
DC/CV, RF and mmWave
TS2000-HP
High Power up to 10kV/600A
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On wafer high power device measurement up to 10kV/600A
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Gold plated chuck surface for minimum contact resistance and vacuum holes for thin wafer handling down to 50 μm
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Taiko wafer chuck option
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Dedicated high voltage and high current probes
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Anti-arcing solutions