top of page
mpi_logo copy.png

200mm Probe Stations

MANUAL SYSTEMS

TS200
Standard Configuration
7. MPI TS200 Manual Probe Station.png

  • Unique puck controlled air bearing stage for
    quick single-handed operation

  • Rigid platen accommodates up to 10 DC or 4 RF positioners

  • Highly repeatable platen lift design with three discrete positions

TS200-SE
DC/CV, RF and mmWave
01. TS200-SE.png

  • Design for Advanced EMI / RFI / Light-Tight Shielding

  • FemtoAmp low-leakage capabilities

  • Integrated active vibration isolation

  • Ready for temperature range -60 °C to 300 °C

TS200-THZ
01. TS200-THZ.png

  • Seamless integration of any banded, differential or broadband frequency extenders and automated impedance tuners

  • Novel design of extenders/tuners integration for maximum of measurement dynamic

mmWave and sub-mmWave
TS200-HP
TS200-HP_front view.png

  • Unique puck controlled air bearing stage for quick single-handed operation

  • Rigid platen accommodates up to 10 high voltage or 4 high current positioners

High Power up to 10kV, 600A

AUTOMATED SYSTEMS

TS2000
01. TS2000-frontview.png

  • Designed with easy single wafer front load

  • Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder

Standard Configuration
TS2000-SE
01.TS2000-SE_frontview.png

  • Device Modeling - DC-IV / DC-CV / Pulse-IV

  • RF and mmW - RF from 26 GHz to 110 GHz

  • FA - Probe card / Internode Probing

  • WLR - Hot/Cold/Long-term test

DC/CV, RF and mmWave
TS2000-IFE
01.1 TS2000-IFE_frontview.png

  • MPI IceFreeEnvironment™ for using MicroPositioners and probe cards simultaneously, even at negative temp

  • Programmable microscope movements for more automation and ease of use

  • The shortest cable interface to IC tester

  • Minimize the platen-to-chuck distance for mmW & probing with active probes

  • Supports film-frame probing

Flexible and Expandable
DC/CV, RF and mmWave
TS2000-HP
High Power up to 10kV/600A
01. TS2000-HP_frontview.png

  • On wafer high power device measurement up to 10kV/600A

  • Gold plated chuck surface for minimum contact resistance and vacuum holes for thin wafer handling down to 50 μm

  • Taiko wafer chuck option

  • Dedicated high voltage and high current probes

  • Anti-arcing solutions

bottom of page