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METROLOGY & INSPECTION

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Automated Optical Inspection

  • 2D or 3D

  • Wafer, Diced on Frame, Substrates, Modules, Wire Bonds, PCB

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MultiSensor Metrology

  • Bow, Warp and TTV

  • Trench Depth, Thickness

  • Overlay

  • Topography (Shape, Structure)

  • Roughness

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Film Thickness/Trench Depth

  • Ultra Thin & Thick Films

  • Multi-Layer Films Stacks

  • Depth, CDs, Profiles

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