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2D or 3D
Wafer, Diced on Frame, Substrates, Modules, Wire Bonds, PCB
Transparent or Opaque
Smooth to Rough
Low to High Reflectivity
Sub-nm to mm
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Bow & Stress
R&D and Production
Ultra Thin & Thick Films
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Depth, CDs, Profiles
Trace Elemental Surface Contamination
Metal Film Metrology
-50C to +300C
600mm x 600mm
CTE & Strain Analysis
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