5G_6G Solutions | CWI Technical Sales | United States

top of page

Request a Quote

AUTOMOTIVE SOLUTIONS

Screen Shot 2021-11-19 at 2.20.58 PM.png

Probe Stations

Manual, Semi-Auto, Fully-Auto
DC, RF, High Power and Photonics
RF Probes and Probe Cards
Micropositioners

Thermal Forcing Systems

-100° to +300°C
Tabletop to Production
Quiet & Eco-Friendly

Optical Device Test

VCSELs
EELs
Image Sensors
Photodiodes

High Frequency.png

Test Sockets

High Frequency & mmWave
High Power
Kelvin
WLCSP

T&M_Thermal Platforms.jpg

Thermal Platforms

-100°C to +200°C
Benchtop or Rackmounted
Various Sizes
Customizable
LN2, LCO2 or Mechanical Cooling

PM35_530px

Test Handlers

Leaded & QFN Packages
Variety of Inputs & Outputs
Inspection

Plasma Cleaning

Plasma Cleaning

Plasma Cleaning
Plasma Descum
Adhesion Improvement

Die Bonding

Manual Die Bonders
Semi-Automated Die Bonders
Fully-Automated Die Bonders
Flip Chip Bonders
Thermosonic Die Bonding
Thermocompression Die Bonding

Wire Bonding

Manual, Semi-Auto and Fully-Automated Wire Bonders
Ball or Wedge Bonding
Fine or Heavy Wire Bonding

Screen Shot 2018-12-25 at 11.06.05 AM.pn

Bond Testing

Die Shear, Wire Pull, Adhesion, Ball Pull, etc.
Revolving Measurement Unit
Automation

Reflow/Soldering

Fluxless solder reflow
Solder Paste reflow
Batch and In-line Reflow Systems

pink sintering

Sintering

Up to 200t Pressure
Controlled atmosphere
Up to 350C
Modular System
Direct to Copper Sintering

de-voiding ableprint

Underfill Curing Oven (PCO)/Autoclave

2.5D and 3D Underfill Void Removal
NCP/CUF/DAF/FOW Curing
Die Attach Curing

Screen Shot 2019-02-11 at 5.14.09 PM.png

Dicing

Laser or Saw Dicing
Up to 12"
Wafers, Packages or Materials

Sorting

High Speed or High Flexibility Die Sorting
From Wafer Frame, Waffle or Gel Packs
To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

Automated Optical Inspection

Wafers, Modules, or Substrates
2D or 3D AOI
Bump/Pillar, EPI, Dicing Inspection

PPI RapiTrim-C.png

Laser Trimming and Test Systems

Thin and Thin Film Trimming
Unique, proprietary flying probe technology
High Reliability Fiber Laser or DPSSL

PPI ProVia System.png

Single or Dual Laser
High performance beam positioning
Blind Via and Through Via Drilling, Routing, Patterning, Defect Repair

Laser Drilling

Vacuum Drying

Laser Trimming

bottom of page