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Probe Stations

  • Manual, Semi-Auto, Fully-Auto

  • DC, RF, High Power and Photonics

  • RF Probes and Probe Cards

  • Micropositioners


Thermal Forcing Systems

  • -100° to +300°C

  • Tabletop to Production

  • Quiet & Eco-Friendly


Optical Device Test

  • VCSELs

  • EELs

  • Image Sensors

  • Photodiodes

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Test Sockets

  • High Frequency & mmWave

  • High Power

  • Kelvin


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Thermal Platforms

  • -100°C to +200°C

  • Benchtop or Rackmounted

  • Various Sizes

  • Customizable

  • LN2, LCO2 or Mechanical Cooling


Test Handlers

  • Leaded & QFN Packages

  • Variety of Inputs & Outputs

  • Inspection

Plasma Cleaning

Plasma Cleaning

  • Plasma Cleaning

  • Plasma Descum

  • Adhesion Improvement


Die Bonding

  • Manual Die Bonders

  • Semi-Automated Die Bonders

  • Fully-Automated Die Bonders

  • Flip Chip Bonders

  • Thermosonic Die Bonding

  • Thermocompression Die Bonding


Wire Bonding

  • Manual, Semi-Auto and Fully-Automated Wire Bonders

  • Ball or Wedge Bonding

  • Fine or Heavy Wire Bonding

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Bond Testing

  • Die Shear, Wire Pull, Adhesion, Ball Pull, etc.

  • Revolving Measurement Unit

  • Automation



  • Fluxless solder reflow

  • Solder Paste reflow

  • Batch and In-line Reflow Systems

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  • Up to 200t Pressure

  • Controlled atmosphere

  • Up to 350C

  • Modular System

  • Direct to Copper Sintering

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Underfill Curing Oven (PCO)/Autoclave

  • 2.5D and 3D Underfill Void Removal

  • NCP/CUF/DAF/FOW Curing

  • Die Attach Curing

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  • Laser or Saw Dicing

  • Up to 12"

  • Wafers, Packages or Materials



  • High Speed or High Flexibility Die Sorting

  • From Wafer Frame, Waffle or Gel Packs

  • To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk


Automated Optical Inspection

  • Wafers, Modules, or Substrates 

  • 2D or 3D AOI

  • Bump/Pillar, EPI, Dicing Inspection

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Laser Trimming and Test Systems

  • Thin and Thin Film Trimming

  • Unique, proprietary flying probe technology

  • High Reliability Fiber Laser or DPSSL

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  • Single or Dual Laser

  • High performance beam positioning

  • Blind Via and Through Via Drilling, Routing, Patterning, Defect Repair

Laser Drilling

Vacuum Drying
Laser Trimming
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