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ADVANCED PACKAGING SOLUTIONS

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Plasma Cleaning
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Plasma Cleaning

  • Plasma Cleaning

  • Plasma Descum

  • Adhesion Improvement

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Die Bonding

  • Manual Die Bonders

  • Semi-Automated Die Bonders

  • Fully-Automated Die Bonders

  • Flip Chip Bonders

  • Thermosonic Die Bonding

  • Thermocompression Die Bonding

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Wire Bonding

  • Manual, Semi-Auto and Fully-Automated Wire Bonders

  • Ball or Wedge Bonding

  • Fine or Heavy Wire Bonding

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Bond Testing

  • Die Shear, Wire Pull, Adhesion, Ball Pull, etc.

  • Revolving Measurement Unit

  • Automation

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Reflow/Soldering

  • Fluxless solder reflow

  • Flux based reflow

  • Batch and In-line Reflow Systems

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Sintering

  • Up to 200t Pressure

  • Controlled atmosphere

  • Up to 350C

  • Modular System

  • Direct to Copper Sintering

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Pressure Curing Oven (PCO)/Autoclave

  • 2.5D and 3D Underfill Void Removal

  • NCP/CUF/DAF/FOW Curing

  • Die Attach Curing

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Dicing

  • Laser or Saw Dicing

  • Up to 12"

  • Wafers, Packages or Materials

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Sorting

  • High Speed or High Flexibility Die Sorting

  • From Wafer Frame, Waffle or Gel Packs

  • To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

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Automated Optical Inspection

  • Wafers, Modules, or Substrates 

  • 2D or 3D AOI

  • Bump/Pillar, EPI, Dicing Inspection

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Vacuum Drying

  • max 200C

  • Heating: Hot water, Thermal Oil, Electric

  • Shelf Area: 1 to 20m2

  • High-Grade Stainless Steel

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  • Soldering Fixtures

  • Base Plates, Coolers, Pin Fin, Spacers

  • Heat Sinks

  • Components for Diodes/Thyristors

Aluminum Graphite Fixtures/Base Plates

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Laser Trimming and Test Systems

  • Thin and Thin Film Trimming

  • Unique, proprietary flying probe technology

  • High Reliability Fiber Laser or DPSSL

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Laser Drilling

  • Single or Dual Laser

  • High performance beam positioning

  • Blind Via and Through Via Drilling, Routing, Patterning, Defect Repair

Vacuum Drying
Laser Trimming
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