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ADVANCED PACKAGING SOLUTIONS

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Plasma Cleaning
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Plasma Cleaning

  • Plasma Cleaning

  • Plasma Descum

  • Adhesion Improvement

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Die Bonding

  • Manual Die Bonders

  • Semi-Automated Die Bonders

  • Fully-Automated Die Bonders

  • Flip Chip Bonders

  • Thermosonic Die Bonding

  • Thermocompression Die Bonding

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Automated Optical Inspection

  • Pre and Post-Dice Wafers

  • Bonded Wafers

  • RDL

  • 2D or 3D AOI

  • Bump/Pillar, Dicing Inspection

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Bump Shear Test

  • Die Shear, Adhesion, Ball Pull, etc.

  • Revolving Measurement Unit

  • Automation

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Bump Reflow

  • Fluxless solder reflow

  • Flux based reflow

  • Batch and Production Reflow Systems

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Bump, Pillar, RDL

  • PVD or ECD

  • UBM for Bumping and RDL

  • Interposers, Fan-Out and TSV

  • FSM & BSM

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Pressure Curing Oven (PCO)/Autoclave

  • 2.5D and 3D Underfill Void Removal

  • NCP/CUF/DAF/FOW Curing

  • Die Attach Curing

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High Resolution Printing

  • 1 - 10um Feature Sizes

  • Conductive and Non-Conductive Materials

  • Printing on Heterogeneous Materials and 3D Topographies

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Sorting

  • High Speed or High Flexibility Die Sorting

  • From Wafer Frame, Waffle or Gel Packs

  • To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

Vacuum Drying
Laser Trimming
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