FAILURE ANALYSIS & RELIABILITY

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Acoustic Microscopy

  • Voids in Microelectronics​

  • Bonded Wafer Defects

  • Defects in Materials and Composites

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Decapsulation

  • Remove Mold Compound

  • Expose the Device Surface

  • Chemical Etch

  • Copper Protect

  • Plasma Etch

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ESD

  • HBM, MM, TLP, HMM, VF-TLP, CDM​

  • Device and Wafer Testing