FAILURE ANALYSIS & RELIABILITY

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Acoustic Microscopy

  • Voids in Microelectronics​

  • Bonded Wafer Defects

  • Defects in Materials and Composites

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Decapsulation

  • Remove Mold Compound

  • Expose the Device Surface

  • Chemical Etch

  • Copper Protect

  • Plasma Etch

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ESD

  • HBM, MM, TLP, HMM, VF-TLP, CDM​

  • Device and Wafer Testing

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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