Acoustic Microscopy

• Voids in Microelectronics​

• Bonded Wafer Defects

• Defects in Materials and Composites

Decapsulation

• Remove Mold Compound

• Expose the Device Surface

• Chemical Etch

• Copper Protect

• Plasma Etch

ESD

• HBM, MM, TLP, HMM, VF-TLP, CDM​

• Device and Wafer Testing