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FAILURE ANALYSIS & RELIABILITY

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Acoustic Microscopy

  • Voids in Microelectronics​

  • Bonded Wafer Defects

  • Defects in Materials and Composites

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Bond Analysis

  • Voids

  • Cracks

  • Delamination

  • Inclusions

  • Foreign Objects

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ESD

  • HBM, MM, TLP, HMM, VF-TLP, CDM​

  • Device and Wafer Testing

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