FAILURE ANALYSIS & RELIABILITY

probe_MPI.jpg

Probe Stations

  • Up to 300mm substrates​

  • Probing from -60 to 300C

  • Probe together with Probe Card

MPI Laser.png

Laser Cutting Systems

  • 1064nm, 532nm, 355nm or 266nm

  • Single Shot, Continuous, or Burst Mode

  • Up to 1.2 mJ

AARTS_rf-htol.jpg

Accelerated Reliability Test Systems

  • DC and RF Accelerated Lift Test​

  • High Voltage Switching Life Test

  • RF Bias and DC HTOL Systems

Screen Shot 2019-03-23 at 8.49.01 AM.png

Acoustic Microscopy

  • Voids in Microelectronics​

  • Bonded Wafer Defects

  • Defects in Materials and Composites

Decapped Die.png

Decapsulation

  • Remove Mold Compound

  • Expose the Device Surface

  • Chemical Etch

  • Copper Protect

  • Plasma Etch

ESD_BGA.png

ESD

  • HBM, MM, TLP, HMM, VF-TLP, CDM​

  • Device and Wafer Testing

probe_MPI.jpg

Probe Stations

  • Up to 300mm substrates​

  • Probing from -60 to 300C

  • Probe together with Probe Card

Screen Shot 2019-05-02 at 10.29.11 AM.pn

Micro Cleaving

  • Quality natural cleave without contamination​

  • Accuracy down to 100nm in 10 minutes

  • Target never lost

Warpage.png

Warpage Metrology

  • -50C to +300C

  • 600mm x 600mm

  • CTE & Strain Analysis

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

© 2023 by Dr. Repair. Proudly created with Wix.com