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FAILURE ANALYSIS & RELIABILITY
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Up to 300mm substrates
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Probing from -60 to 300C
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Probe together with Probe Card
Probe Stations
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1064nm, 532nm, 355nm or 266nm
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Single Shot, Continuous, or Burst Mode
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Up to 1.2 mJ
Laser Cutting Systems
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DC and RF Accelerated Lift Test
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High Voltage Switching Life Test
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RF Bias and DC HTOL Systems
Accelerated Reliability Test Systems
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Voids in Microelectronics
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Bonded Wafer Defects
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Defects in Materials and Composites
Acoustic Microscopy
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Remove Mold Compound
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Expose the Device Surface
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Chemical Etch
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Copper Protect
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Plasma Etch
Decapsulation
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Submicron spatial resolution
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Full Field Imaging
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Nano-second Transient
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Easy Sample Preparation
Thermoreflectance
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Quality natural cleave without contamination
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Accuracy down to 100nm in 10 minutes
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Target never lost
