Failure Analysis/Reliability | CWI Technical Sales | United States

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FAILURE ANALYSIS & RELIABILITY

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Acoustic Microscopy

Voids in Microelectronics
Bonded Wafer Defects
Defects in Materials and Composites

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Probe Cards

High Temperature
Low Leakage
Parametric
Cryogenic

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Probe Station

Probe cards and Positioners simultaneously
Microprobing
CAD driven navigation
Testing at various temperatures

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Thermoreflectance

High-speed, ultra-precise thermal mapping at sub-micron scale
Infrared (IR) Thermal Imaging
IR + TR Hybrid Systems
Time-Domain Thermoreflectance
Optical Pump-Probe Techniques

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Probe Cards

High Temperature
Low Leakage
Parametric
Cryogenic

Probe Card and Probes.jpg

Probe Station

Probe cards and Positioners simultaneously
Microprobing
CAD driven navigation
Testing at various temperatures

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