FAILURE ANALYSIS & RELIABILITY

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  • Up to 300mm substrates​

  • Probing from -60 to 300C

  • Probe together with Probe Card

Probe Stations

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  • 1064nm, 532nm, 355nm or 266nm

  • Single Shot, Continuous, or Burst Mode

  • Up to 1.2 mJ

Laser Cutting Systems

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  • DC and RF Accelerated Lift Test​

  • High Voltage Switching Life Test

  • RF Bias and DC HTOL Systems

Accelerated Reliability Test Systems

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  • Voids in Microelectronics​

  • Bonded Wafer Defects

  • Defects in Materials and Composites

Acoustic Microscopy

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  • Remove Mold Compound

  • Expose the Device Surface

  • Chemical Etch

  • Copper Protect

  • Plasma Etch

Decapsulation

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  • HBM, MM, TLP, HMM, VF-TLP, CDM​

  • Device and Wafer Testing

ESD

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  • Submicron spatial resolution​

  • Full Field Imaging

  • Nano-second Transient

  • Easy Sample Preparation

Thermoreflectance

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  • Quality natural cleave without contamination​

  • Accuracy down to 100nm in 10 minutes

  • Target never lost

Micro Cleaving

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  • -50C to +300C

  • 600mm x 600mm

  • CTE & Strain Analysis

Warpage Metrology

CALL US

Tel: 732-536-3964

 HOURS

Mon - Fri: 8am - 6pm

OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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