• Plasma Cleaning

• Plasma Descum

• Adhesion Improvement

Plasma Cleaning

• Manual Die Bonders

• Semi-Automated Die Bonders

• Fully-Automated Die Bonders

• Flip Chip Bonders

• Thermosonic Die Bonding

• Thermocompression Die Bonding

Die Bonding

• Manual, Semi-Auto and Fully-Automated Wire Bonders

• Ball or Wedge Bonding

• Fine or Heavy Wire Bonding

Wire Bonding

• Die Shear, Wire Pull, Adhesion, Ball Pull, etc.

• Revolving Measurement Unit

• Automation

Bond Testing

• Fluxless solder reflow

• Flux based reflow

• Batch and In-line Reflow Systems

Reflow/Soldering

• Up to 200t Pressure

• Controlled atmosphere

• Up to 350C

• Modular System

• Direct to Copper Sintering

Sintering

• 2.5D and 3D Underfill Void Removal

• NCP/CUF/DAF/FOW

• Warpage Control

Underfill Curing/

De-Voiding

• Laser or Saw Dicing

• Up to 12"

• Wafers, Packages or Materials

Dicing

• High Speed or High Flexibility Die Sorting

• From Wafer Frame, Waffle or Gel Packs

• To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

Sorting

• Wafers, Modules, or Substrates 

• 2D or 3D AOI

• Bump/Pillar, EPI, Dicing Inspection

Automated Optical Inspection

• -55 to +300C

• 600 x 600mm

• Sub-micron warpage and strain metrology

Warpage Metrology