Backend Solutions | CWI Technical Sales | United States

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BACKEND SOLUTIONS

Underfill Curing / De-voiding

Gel-Pak Products

Wafer Bump Reflow

Plasma Cleaning

Reflow / Soldering

Automated Optical Inspection

Laser Trimming and Test

Active Alignment

Plasma Cleaning

Plasma Cleaning

Plasma Cleaning
Plasma Descum
Adhesion Improvement

Die Bonding

Manual Die Bonders
Semi-Automated Die Bonders
Fully-Automated Die Bonders
Flip Chip Bonders
Thermosonic Die Bonding
Thermocompression Die Bonding

Wire Bonding

Manual, Semi-Auto and Fully-Automated Wire Bonders
Ball or Wedge Bonding
Fine or Heavy Wire Bonding

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Bond Testing

Die Shear, Wire Pull, Adhesion, Ball Pull, etc.
Revolving Measurement Unit
Automation

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Reflow/Soldering

Fluxless solder reflow
Flux based reflow
Batch and In-line Reflow Systems

pink sintering

Sintering

Up to 200t Pressure
Controlled atmosphere
Up to 350C
Modular System
Direct to Copper Sintering

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Pressure Curing Oven (PCO)/Autoclave

2.5D and 3D Underfill Void Removal
NCP/CUF/DAF/FOW Curing
Die Attach Curing

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Advanced Packaging Metrology

PI and PR film thickness
CD and overlay
TSV metrology, fill
monitoring, trenches
seed layer metal inspection
etc

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Active Alignment

Edge Coupling
Loop Coupling
Grating Coupling (Surface)
Lensed Fiber. Lens. Free-Space.
Array Coupling

Automated Optical Inspection

Wafers, Modules, or Substrates
2D or 3D AOI
Bump/Pillar, EPI, Dicing Inspection

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UBM/Bumps/Pillars

NEXX APOLLO high throughout sputtering system for thick and thin films
NEXX STRATUS for processing RDLs, Copper Pillars and TSVs in one tool

Soldering Fixtures
Base Plates, Coolers, Pin Fin, Spacers
Heat Sinks
Components for Diodes/Thyristors

Aluminum Graphite Fixtures/Base Plates

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Laser Trimming and Test Systems

Thick and Thin Film Trimming
Unique, proprietary flying probe technology
High Reliability Fiber Laser or DPSSL

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Advanced
Packaging Metrology

PI and PR film thickness
CD and overlay
TSV metrology, fill
monitoring, trenches
seed layer metal inspection
etc

Gel-Pak

Vacuum Release Trays
Gel Boxes and Trays
BTXF/WPX Textured Device Carriers
Gel-Probe

Ultrasonic Welding

Laser Trimming

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