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Plasma Cleaning
Plasma Descum
Adhesion Improvement
Manual Die Bonders
Semi-Automated Die Bonders
Fully-Automated Die Bonders
Flip Chip Bonders
Thermosonic Die Bonding
Thermocompression Die Bonding
Manual, Semi-Auto and Fully-Automated Wire Bonders
Ball or Wedge Bonding
Fine or Heavy Wire Bonding
Die Shear, Wire Pull, Adhesion, Ball Pull, etc.
Revolving Measurement Unit
Automation
Fluxless solder reflow
Flux based reflow
Batch and In-line Reflow Systems
Up to 200t Pressure
Controlled atmosphere
Up to 350C
Modular System
Direct to Copper Sintering
2.5D and 3D Underfill Void Removal
NCP/CUF/DAF/FOW Curing
Die Attach Curing
Laser or Saw Dicing
Up to 12"
Wafers, Packages or Materials
High Speed or High Flexibility Die Sorting
From Wafer Frame, Waffle or Gel Packs
To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk
Wafers, Modules, or Substrates
2D or 3D AOI
Bump/Pillar, EPI, Dicing Inspection
max 200C
Heating: Hot water, Thermal Oil, Electric
Shelf Area: 1 to 20m2
High-Grade Stainless Steel
Soldering Fixtures
Base Plates, Coolers, Pin Fin, Spacers
Heat Sinks
Components for Diodes/Thyristors
Thin and Thin Film Trimming
Unique, proprietary flying probe technology
High Reliability Fiber Laser or DPSSL
Single or Dual Laser
High performance beam positioning
Blind Via and Through Via Drilling, Routing, Patterning, Defect Repair