Backend Solutions | CWI Technical Sales | United States

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BACKEND SOLUTIONS

Underfill Curing / De-voiding

High Resolution Printing

Wafer Bump Reflow

Plasma Cleaning

Reflow / Soldering

Automated Optical Inspection

Ultrasonic Welding

Laser Trimming and Test

Plasma Cleaning

Plasma Cleaning

Plasma Cleaning
Plasma Descum
Adhesion Improvement

Die Bonding

Manual Die Bonders
Semi-Automated Die Bonders
Fully-Automated Die Bonders
Flip Chip Bonders
Thermosonic Die Bonding
Thermocompression Die Bonding

Wire Bonding

Manual, Semi-Auto and Fully-Automated Wire Bonders
Ball or Wedge Bonding
Fine or Heavy Wire Bonding

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Bond Testing

Die Shear, Wire Pull, Adhesion, Ball Pull, etc.
Revolving Measurement Unit
Automation

wire bonding pink

Reflow/Soldering

Fluxless solder reflow
Flux based reflow
Batch and In-line Reflow Systems

pink sintering

Sintering

Up to 200t Pressure
Controlled atmosphere
Up to 350C
Modular System
Direct to Copper Sintering

de-voiding ableprint

Pressure Curing Oven (PCO)/Autoclave

2.5D and 3D Underfill Void Removal
NCP/CUF/DAF/FOW Curing
Die Attach Curing

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High Resolution Printing

1 - 10um Feature Sizes
Conductive and Non-Conductive Materials
Printing on Heterogeneous Materials and 3D Topographies

Sorting

High Speed or High Flexibility Die Sorting
From Wafer Frame, Waffle or Gel Packs
To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

Automated Optical Inspection

Wafers, Modules, or Substrates
2D or 3D AOI
Bump/Pillar, EPI, Dicing Inspection

Ultrasonic Welding

High quality metallic connections
Excellent electrical properties in the connection area, as a result of low thermal stress of the workpieces
Power Modules
Manual, Semi-Auto, Fully-Auto

Soldering Fixtures
Base Plates, Coolers, Pin Fin, Spacers
Heat Sinks
Components for Diodes/Thyristors

Aluminum Graphite Fixtures/Base Plates

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Laser Trimming and Test Systems

Thick and Thin Film Trimming
Unique, proprietary flying probe technology
High Reliability Fiber Laser or DPSSL

UBM/Bumps/Pillars

NEXX APOLLO high throughout sputtering system for thick and thin films
NEXX STRATUS for processing RDLs, Copper Pillars and TSVs in one tool

Dicing

Saw Dicing
Up to 12"
Wafers, Packages or Materials

Ultrasonic Welding

Laser Trimming

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