Plasma Cleaning

• Plasma Cleaning

• Plasma Descum

• Adhesion Improvement

Die Bonding

• Manual Die Bonders

• Semi-Automated Die Bonders

• Fully-Automated Die Bonders

• Flip Chip Bonders

• Thermosonic Die Bonding

• Thermocompression Die Bonding

Wire Bonding

• Manual, Semi-Auto and Fully-Automated Wire Bonders

• Ball or Wedge Bonding

• Fine or Heavy Wire Bonding

Bond Testing

• Die Shear, Wire Pull, Adhesion, Ball Pull, etc.

• Revolving Measurement Unit

• Automation

Reflow/Soldering

• Fluxless solder reflow

• Flux based reflow

• Batch and In-line Reflow Systems

Sintering

• Up to 200t Pressure

• Controlled atmosphere

• Up to 350C

• Modular System

• Direct to Copper Sintering

Pressure Curing Oven (PCO)/Autoclave

• 2.5D and 3D Underfill Void Removal

• NCP/CUF/DAF/FOW Curing

• Die Attach Curing

Dicing

• Laser or Saw Dicing

• Up to 12"

• Wafers, Packages or Materials

Sorting

• High Speed or High Flexibility Die Sorting

• From Wafer Frame, Waffle or Gel Packs

• To Wafer Frame, Waffle or Gel Packs, Tape & Reel or Bulk

Automated Optical Inspection

• Wafers, Modules, or Substrates 

• 2D or 3D AOI

• Bump/Pillar, EPI, Dicing Inspection

Vacuum Drying

• max 200C

• Heating: Hot water, Thermal Oil, Electric

• Shelf Area: 1 to 20m2

• High-Grade Stainless Steel