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300mm Probe Stations

MANUAL SYSTEMS

TS300
Standard Configuration
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  • Unique puck controlled air bearing stage for quick single-handed operation

  • Rigid platen accommodates up to 10 DC or 4 RF positioners

  • Highly repeatable platen lift design with three discrete positions

TS300-SE
DC/CV, RF and mmWave
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  • Design for Advanced EMI / RFI / Light-Tight Shielding

  • FemtoAmp low-leakage capabilities

  • Integrated active vibration isolation

  • Ready for temperature range -60 °C to 300 °C

AUTOMATED SYSTEMS

TS3000
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  • Designed with easy single wafer front load

  • Large Probe Platen supporting up to 12x DC or 4x DC + 4x RF MicroPositioners or standard 4.5” probe card holder

Standard Configuration
TS3000-SE
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  • Device Modeling - DC-IV / DC-CV / Pulse-IV

  • RF and mmW - RF from 26 GHz to 110 GHz

  • FA - Probe card / Internode Probing

  • WLR - Hot/Cold/Long-term test

DC/CV, RF and mmWave
TS3500
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  • MPI IceFreeEnvironment™ for using MicroPositioners and probe cards simultaneously, even at negative temp

  • Programmable microscope movements for more automation and ease of use

  • The shortest cable interface to IC tester

  • Minimize the platen-to-chuck distance for mmW & probing with active probes

  • Supports film-frame probing

Flexible and Expandable
DC/CV, RF and mmWave
TS3000-HP
High Power up to 10kV/600A
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  • On wafer high power device measurement up to 10kV/600A

  • Gold plated chuck surface for minimum contact resistance and vacuum holes for thin wafer handling down to 50 μm

  • Taiko wafer chuck option

  • Dedicated high voltage and high current probes

  • Anti-arcing solutions

TS3500-SE
MPI-TS3500-SE-Automated-Probe-System-Data-Sheet (2).jpg
  • MPI IceFreeEnvironment™ for using MicroPositioners and probe cards simultaneously, even at negative temp

  • Programmable microscope movements for more automation and ease of use

  • The shortest cable interface to IC tester

  • Minimize the platen-to-chuck distance for mmW & probing with active probes

  • Supports film-frame probing

DC/CV, RF and mmWave
DC/CV, RF and mmWave
TS3500-HP
High Power up to 10kV/600A
TS3500-HP with WaferWallet_front view.png
  • On wafer high power device measurement up to 10kV/600A

  • Gold plated chuck surface for minimum contact resistance and vacuum holes for thin wafer handling down to 50 μm

  • Taiko wafer chuck option

  • Dedicated high voltage and high current probes

  • Anti-arcing solutions