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Photonics Automation
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The Most Advanced Bond Tester on the Market, Featuring Performance & Flexibility
Revolving Measurement Unit (RMU)
0.1gf to 200kgf
Pull, shear, bend, peel, torque
0.075% Accuracy
Fully Integrated Solution for Automated Wafer Testing (Up to 300 MM)
Automated up to 300 mm
Cold bump pull, shear
Debris cleaner
A Bond Tester That Can Grow
Within Your Company
(Extra) Large Area Bond Tester
500 mm in X and 800 mm in Y
2.5gf to 1000kgf