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Backend > Bond Testing

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Condor Sigma
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The Most Advanced Bond Tester on the Market, Featuring Performance & Flexibility

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  • Revolving Measurement Unit (RMU)

  • 0.1gf to 200kgf

  • Pull, shear, bend, peel, torque

  • 0.075% Accuracy

Condor Sigma W12
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Fully Integrated Solution for Automated Wafer Testing (Up to 300 MM)

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  • Revolving Measurement Unit (RMU)

  • Automated up to 300 mm

  • Cold bump pull, shear

  • Debris cleaner

Condor Sigma Lite
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A Bond Tester That Can Grow 

Within Your Company

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  • Revolving Measurement Unit (RMU)

  • 0.1gf to 200kgf

  • Pull, shear, bend, peel, torque

  • 0.075% Accuracy

Condor Sigma XL
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(Extra) Large Area Bond Tester​

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  • Revolving Measurement Unit (RMU)

  • 500 mm in X and 800 mm in Y

  • 2.5gf to 1000kgf

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