The Most Advanced Bond Tester on the Market, Featuring Performance & Flexibility

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• Revolving Measurement Unit (RMU)

• 0.1gf to 200kgf

• Pull, shear, bend, peel, torque

• 0.075% Accuracy

Fully Integrated Solution for Automated Wafer Testing (Up to 300 MM)

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• Revolving Measurement Unit (RMU)

• Automated up to 300 mm

• Cold bump pull, shear

• Debris cleaner

A Bond Tester That Can Grow 

Within Your Company

​

• Revolving Measurement Unit (RMU)

• 0.1gf to 200kgf

• Pull, shear, bend, peel, torque

• 0.075% Accuracy

(Extra) Large Area Bond Tester​

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• Revolving Measurement Unit (RMU)

• 500 mm in X and 800 mm in Y

• 2.5gf to 1000kgf