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Backend > Bond Testing
Condor Sigma
The Most Advanced Bond Tester on the Market, Featuring Performance & Flexibility
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Revolving Measurement Unit (RMU)
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0.1gf to 200kgf
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Pull, shear, bend, peel, torque
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0.075% Accuracy
Condor Sigma W12
Fully Integrated Solution for Automated Wafer Testing (Up to 300 MM)
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Revolving Measurement Unit (RMU)
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Automated up to 300 mm
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Cold bump pull, shear
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Debris cleaner
Condor Sigma Lite
A Bond Tester That Can Grow
Within Your Company
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Revolving Measurement Unit (RMU)
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0.1gf to 200kgf
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Pull, shear, bend, peel, torque
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0.075% Accuracy
Condor Sigma XL
(Extra) Large Area Bond Tester
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Revolving Measurement Unit (RMU)
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500 mm in X and 800 mm in Y
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2.5gf to 1000kgf