ACTIVE ALIGNMENT SYSTEM FOR PHOTONICS, OPTOELECTRONICS AND ADVANCED PACKAGING
Coupling Methods
Edge Coupling.
Direct light coupling into side-exposed waveguides with losses below 1 dB. Ideal for silicon photonics, laser modules, and high-speed optical interconnects
Grating Coupling.
(Surface Coupling)
Vertical coupling via surface-structured gratings, a robust and process compatible solution for wafer-level testing and compact optoelectronic assemblies.
Lensed Fiber. Lens. Free Space Coupling.
Non-contact optical coupling for environments with strict cleanroom, vacuum, or long-term stability requirements — e.g., space applications, high-power lasers, and hybrid opto-mechanical systems.
Loop Coupling.
Used for signal control and distribution within integrated waveguide systems. Light is guided through microrings or microloops, enabling precise coupling between adjacent waveguides.
Fiber Coupling.
Direct Coupling.
Precise coupling of light from laser diodes or VCSELs directly into an optical fiber — without intermediate optics, ensuring minimal loss and high reproducibility.
Array Coupling.
Simultaneous coupling of multiple light sources or waveguides with <1 μm positioning accuracy. Perfect for multi-channel photonic systems requiring high density and alignment stability.
Active alignment is a key enabler of high-performance photonic assembly. Unlike passive alignment, which relies solely on geometric positioning, active alignment uses real-time signal feedback during assembly. This ensures not only precise placement of components but also optimal optical performance and maximum coupling efficiency.
This level of precision is especially critical for single-mode fibers, silicon photonics, and hybrid modules with multiple optical interfaces or non-standard geometries, where even sub-micrometer deviations can cause significant losses.
Tresky’s active alignment solutions combine nanometer accuracy with flexible assembly methods, supporting a wide range of coupling processes and component types. The result is highly reliable, reproducible, and efficient manufacturing, ready to meet the demands of cutting-edge optical systems.
Functionality You Will Love
Maximum Precision & Coupling Efficiency
Compatibility with other DIE Bonding Processes
Higher Process Reliability & Reproducibility
Flexible Process Integration
Faster Setup and Cycle Times
Future-Proof Manufacturing