Die Sorting
Mi Quantum and Quantum Plus
For Mobility and Wearables WLCSP Solution
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Most Advanced AI and Industrial 4.0 Driven Platform!
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Market Leading UPH > 50K UPH!
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MiND.X enabled Vision Platform - Reduce Overkill & Underkill!
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9S AOI - 6S Optical + Sidewall IR, Backside IR and Latest Laser Groove IR AOI (available in Quantum Plus Platform)!
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Most Flexible platform - with Dual Track, De-taper options
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Big Die Size Platform, up to 16x16mm and 35x35mm, both available!
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Industrial 4.0 Automation Available with Auto Cassette and Auto Reel Change Platform - One of its Kind!
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Fast Conversion, Poka-yoke and Self Diagnostics Health Check Platform!
High Speed Attach
(Pre-EMI Sputtering)
Mi10 Series
For Mobility and Wearables EMI Shielding Solution
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Tray or Film Frame Input
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Flip option available upon request
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Market Leading UPH
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Coupled with Pressing Module to meet bond force
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Equipped with 6 Side AOI
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Wide device size range
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Multi-functional EMI Shielding Inspection & Sorting Handler
Mi28 Series
For Mobility and Wearables EMI Shielding Solution
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Market leading UPH
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Capable of handling multiple package sizes
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Equipped with Advanced Automatic Optical Inspection (AOI)
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3D & IR Inspection Available
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Inline detaping and re-taping capability
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Supports multiple tape & reel formats
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Designed for high-volume EMI shielding inspection flow
Smart Multi-Bin Sorting
Mi Series
For Mobility and Wearables Sensor and Display Solution
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Wafer to Wafer Platform
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Design to enable Multiple Bin Sorting - up to 10 bins!
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Multiple Output Cassettes format to cater for multiple bin sorting efficiency
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6S Advanced Sensor and Display level AOI available!
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Industrial Automation ready - incorporating auto wafer cassette handling
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Thin die capability
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Class 100
Die Sort with Smart Binning & Advanced AOI
Mi28W Wafer to Wafer
Mi18 Wafer to Waffle Pack
For HPC and Memory Solution
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Your solutions to Multi Bin sorting! Every bin counts.
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Up to 38 bins Sorting for waffle pack output!
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Both models suited to address your next process and control needs - sort the multi bins to wafer or waffle pack
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Equipped with 6 Side AOI
Smart Multiple Bin Sorter
Mi Series
For Automotive and Renewable Energy Solution
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For SiC post KGD Multiple Bin Sorting
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Market Leading UPH
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Wafer Input to Multiple Tape and Reel
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4 to 8 Tape & Reel available!
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Advanced AOI incorporated
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Detaper available to TnR or Wafer!