Wafer Back Side Marker
CSM2000 / 3000
The CSM series is a semiconductor chip scale wafer level marker that marks the backside of the wafer without chip damage.
Wafer Top Side Marker
WTM200 / 300
The WTM series is a device for marking the wafer with reference die, bad die, wafer ID. Provides wafer top side marking solution that can be processed at a high speed.
Wafer ID Marker
WM080 / 012
The WM series is a wafer ID marking system that is only available in the classroom-level cleanroom. It ensures high stability and high speed machining.
Laser Grooving & Laser Dicing
The LMC3200G uses a DPSS laser to remove low-k and metal layers which cause yield reduction in blade saw process. Significantly improves quality and productivity of the singulation process.
The Laser Debonding system uses a Nanosecond UV Laser with a Flat Top Beam Mode.
Modular System with Cleaning, Flipping and Picking Modules.