The WTM series is a device for marking the wafer with reference die, bad die, wafer ID. Provides wafer top side marking solution that can be processed at a high speed.
The WM series is a wafer ID marking system that is only available in the classroom-level cleanroom. It ensures high stability and high speed machining.
The LMC3200G uses a DPSS laser to remove low-k and metal layers which cause yield reduction in blade saw process. Significantly improves quality and productivity of the singulation process.
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