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Front End > Laser Solutions
LASER SOLUTIONS
Laser Marking
Wafer Back Side Marker
CSM2000 / 3000
The CSM series is a semiconductor chip scale wafer level marker that marks the backside of the wafer without chip damage.
Wafer Top Side Marker
WTM200 / 300
The WTM series is a device for marking the wafer with reference die, bad die, wafer ID. Provides wafer top side marking solution that can be processed at a high speed.
Wafer ID Marker
WM080 / 012
The WM series is a wafer ID marking system that is only available in the classroom-level cleanroom. It ensures high stability and high speed machining.
Laser Grooving & Laser Dicing
LMC3200
The LMC3200G uses a DPSS laser to remove low-k and metal layers which cause yield reduction in blade saw process. Significantly improves quality and productivity of the singulation process.
Laser Debonding
Laser Debonder
The Laser Debonding system uses a Nanosecond UV Laser with a Flat Top Beam Mode.
Modular System with Cleaning, Flipping and Picking Modules.
Laser Annealing (IGBTs)
Laser Annealing
- Thin Laser Annealing (50 - 150um range)
- No thermal damage to sensitive areas
- Green wavelength