Wafer Top Side Marker
WTM200 / 300
The WTM series is a device for marking the wafer with reference die, bad die, wafer ID. Provides wafer top side marking solution that can be processed at a high speed.
Laser Grooving & Laser Dicing
The LMC3200G uses a DPSS laser to remove low-k and metal layers which cause yield reduction in blade saw process. Significantly improves quality and productivity of the singulation process.