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Ableprint Pressure Curing Ovens (PCO) are used to eliminate voids in die attach and underfill applications.

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While Ableprint's VFS Pressure Curing Ovens are used for de-voiding in materials such as DAF, DAP, UF, NCP, and NCF, the unique design of the VTS is dedicated to supporting Fine Pitch and Low Chip Gap applications common in 3DIC and 2.5D applications.

Applications:

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  • Underfill Curing

  • Die Attach Curing

  • Wafer Lamination

  • Via Filling

  • Thermocompression Bonding

  • Composite Forming

  • Polymide Curing

Materials:

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  • Flip Chip CUF

  • NCP/NCF

  • DAF/DAP

  • Polyimide

  • Sintering Paste

  • Solder/Copper Paste

  • TIM Preform

Technologies:

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  • 2.5D/3D

  • FCCSP

  • POP

  • WLP

  • MEMs

  • CIS

  • Memory

  • LED

  • IGBT/MOSFET

VFS
APT_VFS

Pressure Curing Oven (PCO) eliminates voids in DAF (Die Attach Film), TIM (Thermal Interface Material), RCBGA, and CUF (Capillary Underfill).

AFM-980 for R&D
APT_AFM-980

Pressure Curing Oven (PCO) for R&D.

System can be fitted with capabilities of either the VFS or VTS but, with a smaller capacity.

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  • Capacity: 1 Magazine or Wafer Carrier

VTS
APT_VTS

Enhanced Pressure Curing Oven (PCO) that eliminates voids in underfill for Fine Pitch CUF, 3DIC, 2.5D, DAP, DAF, NCF, NCP and CUF (Capillary Underfill).

VTS with Automation
APT_VTAS

VTAS-W is a Pressure Curing Oven (PCO) with FOUP load for 2.5D, 3D, WLP and PLP

PIoneer for PI/PBO Curing
APT_PIoneer

Leading Edge Solution for Wafer Level Processing.

- Polyimide Cure (Liquid & Dry Film)

- PBO Cure

- CUF De-Void & Cure

- Dry Film Attached De-Void & Care

- Die Attach Film De-Void & Cure

PRO : >250C
APT_PRO

Voidless Pneumatic Reflow

- Wafer Bump and Ball Mount Reflow in WLP

- Ball Mount Reflow & TIM-1 Reflow in Die Level Packaging

- Multiple Reflow Recipes setting for Die Warpage Conquering

OVER 40 YEARS EXPERIENCE
PRODUCTS
VISIT US

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

© 2026 CWI Technical Sales, Inc. All rights reserved.

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