Front End > Wafer Bonding

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ALIGNER WAFER BONDERS

AWB 04 & 08 Platform

Alignment and Bonding in One Machine

 

  • In-situ alignment 1 micron accuracy

  • 10-6mbar Vacuum to 2bar process gas. UHV Option

  • Voltage up to 2.5kV

  • Temperature up to 560° C

  • Forces up to 40kN

  • Market leading fast bonding cycle times / high throughput

  • Wafer sizes 2"- 8"

  • In-situ UV cure

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ROCK Platform

The AML ROCK system provides for auto-wafer loading requirements, higher volume production and more.