Probe Stations and Accessories
Alignment and Bonding in One Machine
In-situ alignment 1 micron accuracy
10-6mbar Vacuum to 2bar process gas. UHV Option
Voltage up to 2.5kV
Temperature up to 560° C
Forces up to 40kN
Market leading fast bonding cycle times / high throughput
Wafer sizes 2"- 8"
In-situ UV cure
The AML ROCK system provides for auto-wafer loading requirements, higher volume production and more.