
Front End > Wafer Bonding
ALIGNER WAFER BONDERS
AWB 04 & 08 Platform
Alignment and Bonding in One Machine
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In-situ alignment 1 micron accuracy
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10-6mbar Vacuum to 2bar process gas. UHV Option
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Voltage up to 2.5kV
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Temperature up to 560° C
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Forces up to 40kN
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Market leading fast bonding cycle times / high throughput
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Wafer sizes 2"- 8"
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In-situ UV cure

Heading 6
ROCK Platform
The AML ROCK system provides for auto-wafer loading requirements, higher volume production and more.
