Alignment and Bonding in One Machine

• In-situ alignment 1 micron accuracy

• 10-6mbar Vacuum to 2bar process gas. UHV Option

• Voltage up to 2.5kV

• Temperature up to 560° C

• Forces up to 40kN

• Market leading fast bonding cycle times / high throughput

• Wafer sizes 2"- 8"

• In-situ UV cure

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