Failure Analysis > Micro Cleaving


The MC600i system utilizes Micro Cleaving and Precise Cleaving technologies in two main processes - full process and fast process.

System Highlights

  • Turn-around time drastically reduced

  • Improves yield analysis and characterization

  • improves and enhances SEM imaging

  • High productivity

  • Low cost of ownership


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Perfect Cleave Mechanism (PCM) is a simple manual cleaving tool for cross-section of crystalline materials such as Si, GaN, GaAs, InPh, SiC and others.

System Highlights

  • Perfect quality of cross-section

  • High throughput

  • Improves and enhances SEM imaging

  • Compact size

  • Low cost of ownership