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FLUXLESS WAFER BUMP RELFOW

Fluxless Wafer Bump Reflow using Formic Acid

Pre-Reflow                                     Post-Reflow

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Semi-Auto Wafer Bump Reflow

  • Up to 300mm Wafers

  • Fluxless Process

  • Oxide-free

  • Excellent Uniformity

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Cassette Loaded Wafer Bump Reflow

  • Up to 300mm Wafers

  • Fluxless Process

  • Dual FOUP Loaded

  • Oxide-free

  • Excellent Uniformity

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Inline Cassette Loaded Wafer Bump Reflow

  • Up to 300mm Wafers

  • Fluxless Process

  • FOUP Loaded

  • Oxide-free

  • High Throughput