top of page
Screen Shot 2020-07-13 at 5.32.39 PM.png

Backend > Aluminum Graphite 

schunkgroup@1x.png

Schunk has developed future-oriented composites made of Aluminum Graphite (ALG) for a variety of applications.

The composites are created through the pressurized infiltration of porous graphite with liquid aluminum.  These metal matrix composites (MMCs) impress with their high thermal conductivity, suitable heat-expansion coefficients and very low densities.  

Thanks to outstanding mechanical workability, components can simply be produced from it according to customer specifications.

Below are some examples of products that have been produced.

Please send us a request with what YOU are interested in this material for.

Screen Shot 2020-08-21 at 10.37.25 AM.pn

Products

Soldering Fixtures

Soldering Fixtures

In order to keep dies, substrates or pins in the correct position during soldering. The excellent  mechanical strength and stability of Aluminum Graphite facilitates the production of jigs and fixtures with highly sophisticated features, such as thin-walled designs.  The additional benefit of an adapted thermal expansion behavior makes Aluminum Graphite the first choice for fixtures in backend processing.

  • Excellent stability, durability and lifetime

  • Highly sophisticated features with tight tolerances

  • Well-suited composite material

Aluminium-Graphite-Fixtures-XL.png
19Schunk_Alu_Composites_128_spacers_and_
2019Schunk_Alu_Composites_037_Base_Plate

Base Plates and Spacers

The low thermal coefficient of expansion of Aluminum Graphite makes base plates, spacers and other components compatible with conventional substrates, such as ceramic circuit carriers (DBC).

  • Effective Heat Extraction

  • Low intrinsic weight

  • Increased reliability and service life

  • Customized metallization's

Base Plates, Spacers

Coolers and 

Pin Fin Modules

The low thermal coefficient of expansion of Aluminum Graphite makes base plates, coolers and other components compatible with conventional substrates, such as ceramic circuit carriers (DBC).

  • Lightweight

  • Effective Heat Dissipation

  • Less Warpage during Soldering

  • Improved Thermal Cycling capability

  • Extended Module Lifetime

  • Custom Designs

+

Schunk-Hoffmann-Thermal_Management-Pin-F
Coolers, Pin Fin Modules
2019Schunk_Alu_Composites_053_Heat_Sinks
Schunk-Hoffmann-Thermal_Management-Kuehl

Heat Sinks and

Heat Spreaders

The thermal properties and ability to manufacture components with a wide variety of different geometries make Aluminum Graphite an outstanding material for conducting heat.

  • Customized expansion behavior with regard to the substrate and semiconductor material

  • Customer specific designs

  • Functional surface

  • Attractive cost to benefit ratio

Heat Sinks, Spreaders

Flanges and Housings for Laser Modules and

RF Power Amplifiers

Versatile Microelectronic Packaging

  • Lightweight

  • Efficient Heat Dissipation

  • Similar thermal expansion to semiconductors

  • Various shapes and geometries

2019Schunk_Alu_Composites_027_Housings_X
Flanges.png
Flanges and Housings
Shim.png

Diode/Thyristor Shims

Aluminum Graphite boosts the thermal performance of diode and thyristor modules

  • Effective thermal management

  • Lightweight material

  • Customized part geometries

  • Low stiffness

  • High electrical conductivity

  • Non-critical raw materials

Diode/Thyristor Shims
bottom of page