Eagle-i

The most advanced system for 2D surface defect inspection and metrology

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High volume production 2D inspection solutions for:

• Pre & post bumped wafers

• Probe Mark Inspection

• OQC

• Post dicing

• Reconstructed Wafers

Eagle-T

Higher Resolution, Faster Speed

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Leading 2D inspection capabilities empowered by:

• Genesis detection engine

• New camera

• New high-end optic channel

• Special LED illumination

• CAD based detection

• Cutting edge processing power

Bump & Pillar Inspection

Eagle-AP

Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels

• Next generation bumps down to 2µm

• Ultra high number of bumps measurement per wafer (50 million)

• Bump CD and surface detection

• RDL CD and height measurement

• TSV post-via-fill protrusions (nails)

EagleT-AP

Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels

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Leading inspection and metrology capabilities empowered by:

• Genesis detection engine

• New camera

• New high-end optic channel

• Special LED illumination

• CAD based detection

• Cutting edge processing power

• Next generation bumps down to 2µm

• Ultra high number of bumps measurement per wafer (50 million)

• Bump CD and surface detection

• RDL CD and height measurement

MVP 850G

Die and Wire Bond Inspection

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Key Features:

• Die Placement Metrology

• Die Surface, Edge Crack Detection

• Epoxy Spread and Flow Measurement

• Au, Al, Ag, and Cu Wires to 1um Resolution

• Wedge, Ball, and Stitch Wire Bonds

• Crescent, and Tape Bonds

• SMT Components

Spectra Series II

35" x 35" (890mm x 890mm) Backplane and Large Board AOI

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Key Features:

• SMT, Confocal and SPI capable

• 35” x 35” (890mm x 890mm) Standard Inspection Area

• 5 MP/8MP/12MP Color Camera

• Patriot Plus Quad Lighting

• Standard 10um pixel resolution

• Tri-Linear & 0.5 microns encoders

Ultra V

High Volume and High Performance SMT AOI

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Key Features:

• Standard 10um pixel resolution

• 01005 Ready

• Fast Programming Generation using ePro and Validate

• Lowest False Call Rates

• High Throughput to 14 Sq Inches per second.

• Highest Defect Detection using Quad Color Technology

• Dual linear axis and 0.5 micron linear encoders

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