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Metrology > Automated Optical Inspection

Backend & Metrology > Automated Optical Inspection

Automated Optical Inspection

Whole & Diced Substrate Inspection

CAMTEK

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Whole & Diced Substrate Inspection

Eagle-i

The most advanced system for 2D surface defect inspection and metrology

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High volume production 2D inspection solutions for:

  • Pre & post bumped wafers

  • Probe Mark Inspection

  • OQC

  • Post dicing

  • Reconstructed Wafers

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Unique solutions for:

  • CMOS Image Sensor -Advanced solutions for the smallest pixels

  • MEMS - Meeting your special application requirements

  • LED - Yield improvement solutions

Eagle-T

Higher Resolution, Faster Speed

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Leading 2D inspection capabilities empowered by:

  • Genesis detection engine

  • New camera

  • New high-end optic channel

  • Special LED illumination

  • CAD based detection

  • Cutting edge processing power

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Advanced solutions for Fan-out applications:

  • Down to 2µm RDL inspection

  • Panel handling

  • Warped wafer handling

Bump & Pillar Inspection

Eagle-AP

Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels

  • Next generation bumps down to 2µm

  • Ultra high number of bumps measurement per wafer (50 million)

  • Bump CD and surface detection

  • RDL CD and height measurement

  • TSV post-via-fill protrusions (nails)

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EagleT-AP

Designed for the Advanced Packaging market, providing both 2D and 3D inspection and metrology on the same platform while keeping extremely high performance and throughput levels

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Leading inspection and metrology capabilities empowered by:

  • Genesis detection engine

  • New camera

  • New high-end optic channel

  • Special LED illumination

  • CAD based detection

  • Cutting edge processing power

  • Next generation bumps down to 2µm

  • Ultra high number of bumps measurement per wafer (50 million)

  • Bump CD and surface detection

  • RDL CD and height measurement

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Modules, PCB and Wire

MVP 850G

Die and Wire Bond Inspection

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Key Features:

  • Die Placement Metrology

  • Die Surface, Edge Crack Detection

  • Epoxy Spread and Flow Measurement

  • Au, Al, Ag, and Cu Wires to 1um Resolution

  • Wedge, Ball, and Stitch Wire Bonds

  • Crescent, and Tape Bonds

  • SMT Components

Options:

  • Single or Dual Lane Operation

  • Optional 3D Epoxy Height Measurement

  • AutoWidth

  • Multiple Handling Solutions

  • Custom Handling Solutions

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Spectra Series II

35" x 35" (890mm x 890mm) Backplane and Large Board AOI

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Key Features:

  • SMT, Confocal and SPI capable

  • 35” x 35” (890mm x 890mm) Standard Inspection Area

  • 5 MP/8MP/12MP Color Camera

  • Patriot Plus Quad Lighting

  • Standard 10um pixel resolution

  • Tri-Linear & 0.5 microns encoders

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Options:

  • 35” X 40” (890mm x 1016mm)Inspection Area (XL)

  • Z-Axis Camera Lift

  • Dual Lane

  • Board Indexing

Ultra V

High Volume and High Performance SMT AOI

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Key Features:

  • Standard 10um pixel resolution

  • 01005 Ready

  • Fast Programming Generation using ePro and Validate

  • Lowest False Call Rates

  • High Throughput to 14 Sq Inches per second.

  • Highest Defect Detection using Quad Color Technology

  • Dual linear axis and 0.5 micron linear encoders

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Options:

  • Z-axis Camera Lift

  • Autowidth

  • 3 Stage Conveyor

  • Dual Lane

  • Top Side Reference Board Lifter

  • Flexible Configurable for 3D Laser option

  • XL option provides 20” x 30” board size

Bump & Pillar Inspection
Modules, PCB & Wire

MACHINE VISION PRODUCTS

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