Fully Auto ± 0.3µm Die & Flip Chip Bonder
Ultra-Precision Die & Flip Chip Bonder
Supports ±0.3µm @ 3s placement accuracy
Supports all die attach and flip chip applications including all AFCPlus capabilities
Higher resolution alignment optics
Active vibration damping system
Automatic placement offset tuning system
High resolution 300mm bonding station
Dynamic alignment system
Quantitative parallelism calibration
Single Mode/SiPhotonics/PIC AOC/WLP
Optical Device Packaging
Direct Bond Interconnect
Fully Auto ± 1µm Die & Flip Chip Bonder
Sub-Micron Die & Flip Chip Bonder
Accuracy down to ±1µm @ 3s with cycle-times down to 25 sec AuSn eutectic process
Eutectic laser soldering or epoxy bonding
Small die size down to 100µm
Closed loop bond force control
Optional: flip chip bonding, wafer mapping, post bond inspection, heated tools, etc.
Laser Bar and MEMS assembly
Semiconductor advanced packaging (3D, Stack Die)
Fully Auto ± 2.5µm Die & Flip Chip Bonder
High-Speed Dual Head Die & Flip Chip Bonder
Accuracy down to ±2.5 µm @ 3s with cycle-times down to <3 sec AuSn eutectic process
Modular machine concept for all micro assembly applications
Eutectic laser soldering for high-speed assembly
Supports all dispensing technologies
Offering automatic tool changers
Lidar/Laser Bar and MEMS Assembly
Semiconductor advanced packaging (TSV, eWLB, FanOut, WLP, 3D, Stack Die)
Fully Auto > 3µm Flexible Die & Flip Chip Bonder
The T-6000-L/G is an enhanced version of the proven T-6000-L series. It is a fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system.
This system can be upgraded with new loader and unloader modules. With numerous available options, it can be customized to suit all market needs.
The T-6000-L/G offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process without any additional hardware changes.
The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite mainframe. Developed for a higher throughput and more accuracy, it is best fit for medium sized production.
This platform offers a large working area especially for 12“ wafer handling. Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.
Fully Auto > 8µm Flexible Die & Flip Chip Bonder
The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production.
Equipped with linear motors and 0.1 µm resolution glass scales, this enables a movement precision of 8 µm @ 3Sigma.
A force range of 15g up to 800g, combined with the large working area of 495 x 400 mm and wafer handling up to 8“, this system offers a wide range of applications.
Manual & Semi-Auto Die Bonders
Manual Die & Flip Chip Bonder
The T-4909-AE is a manual, high quality, budget sensitive die bonder with superior ergonomic design. As with all of Tresky’s products, the T-4909 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height. Bonding parameters and sequences, intuitively programmable by an integrated Raspberry PC with touchscreen.
Semi-Automated Die & Flip Chip Bonder
The T-5300 series is Tresky’s newest flexible die bonding platform. The systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options.
As with all of Tresky’s products, the 5300 incorporates True Vertical Technology™ which guarantees parallelism between chip and substrate at any bond height.
The T-5300 really shines in applications with high precision requirements such as flip chip or laser diode alignment. An optional high resolution beam splitter unit allows sub-micron placement accuracy.
Manual Die & Flip Chip Bonder
The T-5100 series is a universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it flexible and adaptable to many tasks in the R&D, small scale and pilot production areas.
The system can be a die sorter, epoxy bonding platform, UV curing assembly or high accuracy bonding system
The T-5100 can be also be configured with a wafer stage with a die ejector to pick directly from wafer tape frame or ring.