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Coaters & Developers

 

PHOTORESIST : S-CUBED

High Volume Production Photoresist processor
  • High volume production photoresist processing for up to 300mm wafers

  • Completely programmable with lowest COO in the industry

  • FOUP, FOSB or Cassettes

  • Up to 4 photoresist dispensers standard

photoresist processing

With the introduction of the SCENE 12-MAX™, S-Cubed has taken the SCENE 12 architecture to its fullest potential with more stacked processes, their most advanced robotics, higher reliability and the lowest overall cost of ownership of any similar wafer processing tool, while keeping overall footprint low.

High Volume Production Photoresist processor
  • Lowest cost of ownership, high volume photoresist processing of wafers up to 200mm

  • High speed handling and programmable wafer centering

  • Designed for production use with a focus on reliability and throughput

Photoresist processor
  • Low footprint production photoresist with radial robot access and stacked modules for up to 200mm wafers

  • Spin Axis is always within one revolution in absolute terms of programmed velocity and trajectory

wafer edge processing
  • This Wafer Edge Processing System is the most flexible and configurable solution in the world

  • Provides concentricity within .75mm, handling wafer sizes to 300mm, with flat following & patterns

  • FOUP, FOSB or Cassettes

  • Up to 4 photoresist dispensers standard

Reticle Cleaner photoresist
  • Back side reticle cleaner (patent pending)

  • Mask handling is only at points on the edge

  • Pellicle does not need to be removed

  • Clears haze, removes organic and particulate contamination

  • Self contained Class I environment when used with SMIF pod

 

DRY PHOTORESIST : MICROCONTROL

BG & Temporary Bonding Film Lamination

Taper and Detaper System

  • Lowest cost of ownership through 'total gap control'

  • Wafer size up to 8"

  • Highest throughput: Process linked - avg. 55 wfrs/hr

  • Ultra thin wafers processing using zero force lamination technology

  • Ultra thin wafer detaping with special chuck

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Taper and Detaper System

  • Lowest cost of ownership through 'total gap control'

  • Wafer size 8 - 12"

  • Throughput: Process linked - avg. 50 wfrs/hr

  • Ultra thin wafers processing using zero force lamination technology

  • Ultra thin wafer detaping with special chuck

Dry Metal Lift Off

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Metal Lift Off System

  • Wafer size: 150 - 200 mm

  • New method to lift off metal with adhesive tape from wafer

  • Allows customer to choose solvent free process

  • Even using solvent there is no need to destroy metal layer to reach photoresist

  • Easier and more environmental friendly method to recycle precious metal waster

DIE Attach Film Lamination

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Laminator and Mylar Removal System

  • Wafer size up to 8"

  • Lowest tape consumption

  • Controlled lamination speed and pressure

  • Controlled roller temperature

  • Controlled chuck temperature

  • Throughput: process linked - average 20 wfrs/h

  • Centering/Alignment: Contactless/Optical System

Photopolymer Film Lamination

dry photoresist microcontrol

Photopolymer Film Lamination & Cover Sheet Removal Systems​

  • Used for BUMPING, WLP and MEMS

  • Up to 8"

  • Low tape consumption

  • Controlled lamination speed and pressure

  • Controlled roller temperature

  • Controlled chuck temperature

dry photoresist microcontrol

Photopolymer Film Lamination & Cover Sheet Removal Systems​

  • Used for BUMPING, WLP and MEMS

  • 8" & 12"

  • Low tape consumption

  • Controlled lamination speed and pressure

  • Controlled roller temperature

  • Controlled chuck temperature