Plasma Treatment Systems
AP Batch Series
AP-600
Bench-top Plasma Treatment Systems
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Touch screen control and graphical user interface give real-time process information
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Flexible shelf architecture allows processing of wide variety of piece parts, components or carriers
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13.56 MHz RF generator with automatic matching network delivers excellent process repeatability
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Convenient facility hook-ups for periodic
calibration requirements used in validation processes
AP-1000
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Plasma chamber constructed of 11-gauge stainless steel with all fixture components housed within an enclosure constructed of rugged power coated aluminum, for superior durability
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13.56 MHz RF generator with automatic impedance matching network delivers excellent process repeatability
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Chamber has multiple removable and adjustable shelves to accommodate a range of part carriers including magazines, trays, wafer and Auer boats
TRAK Automated Series
FlexTRAK™
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Ultimate application flexibility for direct, downstream and ion-free plasma, which allows treatment without exposure to ion and UV
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Integrates with a variety of process equipment, including wire bond, die attach, dispense, mold, and marking
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Slim structure requiring minimal floor space, all service components easily accessible from the front
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Three-axis symmetrical chamber and proprietary process control for unmatched process uniformity
FlexTRAK™-S
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Large-capacity plasma chamber, 9.6 liter, or twice the capacity of standard FlexTRAK™ system, with high uniformity and short cycle times
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Easily integrates with a variety of process equipment, including wire bond, die attach, dispense, mold and marking
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Structure requires minimal floor space with service components easily accessible from the front
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Flexible chamber configurations support direct, downstream and ion-free modes of plasma treatment
FlexTRAK™ CD & FlexTRAK™ CDS
FlexTRAK™ CD
FlexTRAK™ CDS
Designed for high-throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components. The -CD handles up to 5 strips per plasma cycle and the -CDS, with a longer plasma chamber, handles up to 10 strips per plasma cycle. The operation delivers the parts back into the same magazine.
SPHERE Wafer Series
StratoSPHERE™
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Software controlled change-over minimizes transition from 200mm to 300mm wafers
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Production-ready wafer handling supports backside or edge-grip transfer of wafer
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Modular design allows single- or dual-chamber system configuration
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Load ports support 200mm open cassettes or 300mm FOUP
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Unique end-effector design can transfer a variety of wafer thicknesses and weights
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Chamber kits isolate plasma distribution directly above the wafer, maximizing uniformity and throughput
MesoSPHERE™
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Modular design allows capacity increase on a per plasma chamber basis
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EFEM integration supports from 1 to 4 plasma chambers
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Pocket chuck design ensures accurate substrate placement and centering, maximizing process repeatability
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Configurable for wafer, wafer-on-frame, and round/square substrates up to 480mm
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Plasma confinement technology isolates plasma distribution directly above the wafer, minimizing undesired secondary reactions
PCB SYSTEMS
MaxVIA™ & ProVIA™
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High throughput of HDI, flexible and rigid panels for maximum production flexibility
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ProVIA accommodates multiple panel sizes within small footprint
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MaxVIA accommodates larger panel sizes within same chassis as ProVIA
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Fast units per hour (UPH) processing to meet today’s demanding manufacturing schedules- MaxVIA UPH processing is 2x faster than ProVIA
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Low CF4 gas consumption for desmear applications, contributes to lowest cost of ownership in its class
MaxVIA™-Plus
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Larger, 15-cell chamber processes more units per hour (UPH) than standard MaxVIA
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High throughput of HDI, flexible and rigid panels for maximum production flexibility
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Accommodates multiple panel sizes within a small footprint to consume minimal floor space
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Low CF4 gas consumption for desmear applications, contributes to lowest cost of ownership in its class
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Patented system technologies produce superior process uniformity at high throughput