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Plasma Treatment Systems

Semi Systems

SEMI SYSTEMS

AP Batch Series

AP Batch Series
AP-600
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Bench-top Plasma Treatment Systems

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  • Touch screen control and graphical user interface give real-time process information

  • Flexible shelf architecture allows processing of wide variety of piece parts, components or carriers 

  • 13.56 MHz RF generator with automatic matching network delivers excellent process repeatability

  • Convenient facility hook-ups for periodic
    calibration requirements used in validation processes

AP-1000
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  • Plasma chamber constructed of 11-gauge stainless steel with all fixture components housed within an enclosure constructed of rugged power coated aluminum, for superior durability

  • 13.56 MHz RF generator with automatic impedance matching network delivers excellent process repeatability

  • Chamber has multiple removable and adjustable shelves to accommodate a range of part carriers including magazines, trays, wafer and Auer boats

AP-1500
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  • Extra large “batch-type” plasma system used to clean and treat electronic components, circuit boards, and medical & life science devices

  • All components of system are housed within an enclosure constructed of rugged power coated aluminum, for superior durability

  • 13.56 MHz RF generator with automatic impedance matching network

  • Up to 2,000 Watts of RF Power in a completely self contained chassis

RIE System

RIE System
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RIE-1701
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Reactive Ion Etching Plasma System​

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  • Touch screen control and graphical user interface provide real-time process data and feedback

  • 13.56 MHz RF generator with automatic matching network delivers excellent process repeatability

  • Temperature control loop integrated into plasma chamber enables precise control available

  • Optional turbo-molecular pump package and butterfly valve pressure control available

TRAK Automated Series

TRAK Automated Series

FlexTRAK™ 
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  • Ultimate application flexibility for direct, downstream and ion-free plasma, which allows treatment without exposure to ion and UV

  • Integrates with a variety of process equipment, including wire bond, die attach, dispense, mold, and marking

  • Slim structure requiring minimal floor space, all service components easily accessible from the front

  • Three-axis symmetrical chamber and proprietary process control for unmatched process uniformity

FlexTRAK™-S
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  • Large-capacity plasma chamber, 9.6 liter, or twice the capacity of standard FlexTRAK™ system, with high uniformity and short cycle times

  • Easily integrates with a variety of process equipment, including wire bond, die attach, dispense, mold and marking

  • Structure requires minimal floor space with service components easily accessible from the front

  • Flexible chamber configurations support direct, downstream and ion-free modes of plasma treatment

FasTRAK™
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  • Flexible configuration accommodates full range of strip dimensions and magazine designs

  • Advanced robotic handling system minimizes strip handling, pushing, pulling and reduces operator intervention

  • New camera-based material tracking provides 100% plasma treatment validation

  • High-efficiency, application specific, plasma chamber design offers Direct or Ion Free plasma treatment modes

FlexTRAK™ 2MB
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​High-Throughput Processing

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  • Unique boat bypass feature optimizes productivity

  • Multiple inline plasma modules increase throughput

  • High uniform plasma treatment

  • Production ready dual lane boat handling

  • Ideal for pre-Flip-Chip Underfill (FCUF) processes

FlexTRAK™ CD & FlexTRAK™ CDS
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FlexTRAK™ CD

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FlexTRAK™ CDS

Designed for high-throughput processing of lead frame strips, laminated substrates, and other strip-type electronic components. The -CD handles up to 5 strips per plasma cycle and the -CDS, with a longer plasma chamber, handles up to 10 strips per plasma cycle. The operation delivers the parts back into the same magazine.

SPHERE Wafer Series

SPHERE Wafer Series

StratoSPHERE™
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  • Software controlled change-over minimizes transition from 200mm to 300mm wafers

  • Production-ready wafer handling supports backside or edge-grip transfer of wafer

  • Modular design allows single- or dual-chamber system configuration

  • Load ports support 200mm open cassettes or 300mm FOUP

  • Unique end-effector design can transfer a variety of wafer thicknesses and weights

  • Chamber kits isolate plasma distribution directly above the wafer, maximizing uniformity and throughput

MesoSPHERE™
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  • Modular design allows capacity increase on a per plasma chamber basis

  • EFEM integration supports from 1 to 4 plasma chambers

  • Pocket chuck design ensures accurate substrate placement and centering, maximizing process repeatability

  • Configurable for wafer, wafer-on-frame, and round/square substrates up to 480mm

  • Plasma confinement technology isolates plasma distribution directly above the wafer, minimizing undesired secondary reactions

PCB SYSTEMS

PCB Systems
VIA High Volume Series

VIA High Volume Series

FlexVIA™-Plus 
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  • Efficient design, economical gas consumption and small footprint contribute to low cost of ownership

  • Easy loading and versatile horizontal racks allow for processing of various flexible PCB panel sizes

  • Single stage plasma process and capacity for up to 30, 20″ x 32″ panels per cycle, enabling a rate of 140-200 units per hour (UPH)

  • Patented, industry-proven plasma technologies provide superior surface activation, etch back, and desmear process uniformity

RollVIA™
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  • Handles & processes web widths from 100 to 600mm

  • Configurable with 1, 3 or 5 plasma cells to meet process requirements

  • Field-upgradeable to grow with production volume

  • Patented plasma systems produce superior process uniformity

  • Activates, cleans, desmears & etchbacks flexible PCB

  • Isolative technology contains plasma within the process region

MaxVIA™ & ProVIA™
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  • High throughput of HDI, flexible and rigid panels for maximum production flexibility

  • ProVIA accommodates multiple panel sizes within small footprint

  • MaxVIA accommodates larger panel sizes within same chassis as ProVIA

  • Fast units per hour (UPH) processing to meet today’s demanding manufacturing schedules- MaxVIA UPH processing is 2x faster than ProVIA

  • Low CF4 gas consumption for desmear applications, contributes to lowest cost of ownership in its class

MaxVIA™-Plus
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  • Larger, 15-cell chamber processes more units per hour (UPH) than standard MaxVIA

  • High throughput of HDI, flexible and rigid panels for maximum production flexibility

  • Accommodates multiple panel sizes within a small footprint to consume minimal floor space

  • Low CF4 gas consumption for desmear applications, contributes to lowest cost of ownership in its class

  • Patented system technologies produce superior process uniformity at high throughput

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