top of page
ADT_logo.jpg
Dicing Blades
UV Curing Systems
Spindle Chiller
CO2 Injector

DICING SAWS

300mm Dicing Saws

8000 Series

ADT 8020 is a high-efficiency, high performance and low cost fully automatic twin spindle system with up to 12" workpiece size

Applications:

​

  • Silicon wafers

  • Silicon Carbide

  • Glass

  • Glass on Silicon (sensors)

  • SAW Filters

  • MEMS

  • LED & LED Packages

  • Package Singulation (BGA, QFN, LTCC)

Features and Benefits:

​

  • Flexibility - Supports Hub and Hubless blades up to 3" O.D.

  • Spindles of 1.8 kW or 2.2 kW high power (for challenging applications)

  • Intuitive operation interface using a large 17" touch screen monitor

Heading 6

Advantages:

​

  • Highest Dicing Process Speeds - Lowest Cost

  • Air Spindle

  • Fast automatic alignment and cut positioning for increased throughput

  • Automatic Kerf check and quality analysis for maximum precision

  • Process data logging and statistical analysis

  • Fast & Simple Blade Change with a locking spindle shaft

  • SECS/GEM platform ready

  • Full access to any area of the system for easy maintenance access

8230_1.png

7120 & 7130 Series

200mm Dicing Saws

2" and 4" Spindle Dicing Systems

Applications:

​

  • Ceramic Substrates

  • Thick-film Devices

  • Glass

  • Glass on Silicon (sensors)

  • PZT

  • SAW Filters

  • MEMS

  • LED & LED Packages

  • Package Singulation (BGA, QFN, LTCC)

  • Opto-electronic Components

  • IC Wafers

Features and Options:

​

  • Extra large area dicing (7100 XLA)

  • Large area

  • Tilting Spindle

  • Dressing Station for diamonds exposure and clogging prevention

Heading 6

Advantages:

​

  • Full range of automatic vision capabilities

  • Advanced hardware platform for high reliability and low maintenance

  • Heavy Duty, cast-iron base structure for superior precision and accuracy

  • Increased yield, throughput and process control

  • Unique multi-panel processing capabilities

  • Special blade wear forecast algorithm

  • User-friendly software platform

Advanced Dicing Technologies Dicing Saw

7220 Series

Fully Automatic Dicing Systems

With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation.

Applications:

​

  • Silicon

  • Glass on silicon

  • MEMS

  • GaAs wafers

  • Package Singulation (BGA & QFN)

  • LTCC

  • PCB

  • Hard materials

The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.

Advantages:

​

  • Full range of automatic vision capabilities

  • Advanced hardware platform for high reliability and low maintenance

  • Heavy Duty, cast-iron base structure for superior precision and accuracy

  • Increased yield, throughput and process control

  • Unique multi-panel processing capabilities

  • Special blade wear forecast algorithm

  • User-friendly software platform

Advanced Dicing Technologies Dicing Saw

PERIPHERAL EQUIPMENT

Dicing Peripherals
Water Recycling System

ADT Model AR-927 is a Water Recycling System that supplies a uniform flow of clean water for dicing. The System recycles the dicer's drain water through filtration and cooling elements, pumping clean and temperature controlled cutting water to the dicing machine.

AR-927_300px high.png
Wafer Cleaner
977_300px high.png

ADT Model 977 Wafer Cleaner is designed for cleaning workpieces after dicing. It is equipped with a spinning chuck table and a rotating washing/drying arm. The arm can be configured with an atomizing cleaning nozzle or a high pressure nozzle to cope with a wide range of cleanliness requirements

Semi-Auto Wafer Mounter
967.png

ADT 967 Semi-Automatic Wafer Mounter is designed for quality, hands-free mounting of workpieces on tapes.

It features fast, consistent, precise and economic mounting at an exceptional cost-performance.

Manual Wafer Mounter

ADT Model 966 is designed for manual mounting of workpieces on tapes.

Supporting various types of dicing tapes and standard frames. Can be customized 

for multiple substrates (multi-panel) and irregular frames.

966_300px high.png
Mounters
UV Curing Systems

ADT UV Tape Curing System reduces the adhesive strength of all UV-sensitive dicing tapes under controlled environment.

955_300px high.png
Spindle Chiller
937.png

ADT Model 937-A Spindle Chiller is designed for closed-loop supply of spindle cooling water. It maintains stable, temperature-controlled water; an important factor for achieving high dicing accuracy and quality.

CO2 Bubbler
947.jpg

ADT 947 CO2 Bubbler Inline Injector (CO2 Bubbler) is designed to eliminate particle adhesion and device damage caused by electrostatic effects. T he units dissolve CO2 gas into de-ionized water (DI) used for dicing or cleaning process, thus performing consistent control over an optimal level of resistivity.

Dicing Blades

DICING BLADES

Resin Bond Dicing Blades
Resin Dicing Blades_cropped.jpg

• Resin as binder allows for blade wear management rendering Resin-bond Blades an excellent choice for hard and brittle materials such as: QFN/MLF, Thick Ceramic Substrates, HTCC and Glass
 

• Resin Blade thickness varies from 3 mil to 100 mil (depending on diamond grit size)
 

• Diamond grit size ranges from 3 microns to 250 microns (depending on blade thickness)

Metal Sintered Dicing Blades
Metal Sintered Dicing Blades_cropped.jpg

With slower wear rate than Resin but faster than Nickel, Metal-bond (Sintered) blades are best suited for retaining package shape and size in applications such as:

• BGA
• Soft Alumina
• TiC
• LTCC
• Ferrite

Blade thickness varies from 3 mil to 60 mil (depending on diamond grit size)
Diamond grit size ranges from 2 microns to 70 microns (depending on blade thickness)

Nickel Bond Dicing Blades
Nicel Bond Dicing Blades_cropped.jpg

• The Nickel binder provides longer blade life and lower wear rate and together with the abrasive makes Nickel-bond Blades a perfect choice for soft material applications such as: PCB, Silicon and BGA 
 

• Blade thickness varies from 0.8 mil to 20 mil (depending on diamond grit size) 
 

• Diamond grit size ranges from 2-4 microns to 70 microns (depending on blade thickness)

Metal Sintered Dicing Blades
HUB Blades_cropped.jpg

ADT’s range of Hub Blades is a perfect solution for the optimization of the dicing process for various types of materials such as: Silicon, GaAs and other wafers.

 

ADT's Hub Blades provide:

 

• Improved cut quality
• Longer blade life
• Higher UPH

bottom of page