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ECO THERMOSTREAMS

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Eco-friendly Electronics Temperature Test Systems​

  • Consumes less energy

  • Quiet operation

  • No annual leak testing required (EU F-Gas Regulation)

  • Precise temperatures with fast transitions from -80 to 225°C

  • Available for 50 and 60Hz operation

  • No need for Liquid Nitrogen (LN₂) or Liquid Carbon Dioxide (LCO₂)

 

ATS THERMOSTREAMS

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Mobile Temperature Environments - ThermoStreams®

Portable systems that deliver clean dry air for precision temperature testing or conditioning of electronics (ICs, MEMS, transceivers, or circuits) and materials.​

  • No LN₂ or LCO₂ required

  • -100 to +300°C

  • Programmable transitions, up to 15°C/sec

  • 1.0°C accuracy

  • Extended reach for easy DUT access

  • Integrated purging system prevents moisture buildup on the DUT

  • NEW! Quick-connect feature for thermal caps

ATS-870 ThermoStream®
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  • Temperature range: -100 to +225°C

  • Airflow output: 4 to 12 scfm Continuous

ATS-850 ThermoStream®
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  • Temperature range: -90 to +300°C

  • Airflow output: 4 to 18 scfm Continuous

ATS-830 ThermoStream®
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  • Temperature range: -90 to +225°C

  • Airflow output: 4 to 18 scfm Continuous

ATS-810 ThermoStream®
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  • Temperature range: -80 to +225°C

  • Airflow output: 4 to 18 scfm Continuous

ATS-645 ThermoStream®
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  • Temperature range: -80 to +225°C

  • Airflow output: 4 to 18 scfm Continuous

ATS-635-S ThermoStream®
  • Temperature range: -60 to +225°C

  • Airflow output: 5 scfm Fixed Flow

ATS-625 ThermoStream®
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  • Temperature range: -60 to +225°C

  • Airflow output: 6 scfm max

ATS-615 ThermoStream®
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  • Temperature range: -45 to +225°C

  • Airflow output: 12  scfm max

ATS-605 ThermoStream®
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  • Temperature range: -20 to +225°C

  • Airflow output: 4 - 9 scfm

 

THERMAL PLATFORMS / PLATES

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Thermal Platforms (Cold/Hot Plates)

 

Ideal for testing or conditioning low profile items with a flat surface such as RF devices and high density power device testing (IGBTs and MOSFETs).

  • Cryogenic and compressor-based refrigeration systems as low as -100°C and up to +250°C and temperature transitions up to 100°C/min

  • Surface areas from 7 to 700 square inches (45 to 4515 square cm) and larger on request

  • Enclosures for your DUT

 

THERMAL CHAMBERS

Thermal Chambers for Any Temperature Application

Optimal test environments require thermal chambers configured for device size, temperature range, transition speed and device access.​

  • High air flow, promoting fast cycling, low gradients and consistent test results

  • Wide temperature range: -185 to 500°C or anywhere in between​

  • Cooling and heating rates up to 100°C per minute

  • Thermal shock in a single chamber and MIL-STD testing

 

DIRECT CONTACT SYSTEMS

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Direct Contact Temperature Forcing – ThermoSpot®)

 

Direct contact systems that provide an efficient source for IC temperature characterization, including high-Watt emitting devices.

  • High reliability thermal cycling without thermoelectric modules

  • Temperature range: -65 to 175°C

  • Cooling power: 

    • 40W at -40°C for lower power devices

    • 55W at -55°C and 120W at -40°C.

  • Transition rate: up to <35 sec over 25 to -40°C

PROCESS CHILLERS: FLUID & GAS CHILLERS

 

Low Temperature Process Chillers

Thermonics® designs low (-80.0°C) and ultra-low temperature (-120.0°C) chillers for cooling fluids and gasses in process cooling applications.

  • Standard portable chillers and custom chiller systems

  • Temperature ranges from -110 to 300°C

  • Cooling capacities up to 50kW

  • Air or water cooled condensers

  • Pumps and process fluids to match application

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THERMOCHUCK SYSTEMS

 

ThermoChuck® for Wafer Probe Stations

Conductive heating and cooling systems for wafer testing at temperature. Its primary use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in.

  • -65C to +300°C

  • 150mm, 200mm & 300mm

  • Retrofits available for existing probe stations