Eco-friendly Electronics Temperature Test Systems​​

• Consumes less energy

• Quiet operation

• No annual leak testing required (EU F-Gas Regulation)

• Precise temperatures with fast transitions from -80 to 225°C

• Available for 50 and 60Hz operation

• No need for Liquid Nitrogen (LN₂) or Liquid Carbon Dioxide (LCO₂)

Thermal Platforms (Cold/Hot Plates)​

Ideal for testing or conditioning low profile items with a flat surface such as RF devices and high density power device testing (IGBTs and MOSFETs).​

• Cryogenic and compressor-based refrigeration systems as low as -100°C and up to +250°C and temperature transitions up to 100°C/min

• Surface areas from 7 to 700 square inches (45 to 4515 square cm) and larger on request

• Enclosures for your DUT

Thermal Chambers for Any Temperature Application​

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Optimal test environments require thermal chambers configured for device size, temperature range, transition speed and device access.​

• High air flow, promoting fast cycling, low gradients and consistent test results

• Wide temperature range: -185 to 500°C or anywhere in between​

• Cooling and heating rates up to 100°C per minute

• Thermal shock in a single chamber and MIL-STD testing

Direct Contact Temperature Forcing – ThermoSpot®)

Direct contact systems that provide an efficient source for IC temperature characterization, including high-Watt emitting devices.​

• High reliability thermal cycling without thermoelectric modules

• Temperature range: -65 to 175°C

• Cooling power: 

  • 40W at -40°C for lower power devices

  • 55W at -55°C and 120W at -40°C.

• Transition rate: up to <35 sec over 25 to -40°C

Low Temperature Process Chillers​

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Thermonics® designs low (-80.0°C) and ultra-low temperature (-120.0°C) chillers for cooling fluids and gasses in process cooling applications.

• Standard portable chillers and custom chiller systems

• Temperature ranges from -110 to 300°C

• Cooling capacities up to 50kW

• Air or water cooled condensers

• Pumps and process fluids to match application

ThermoChuck® for Wafer Probe Stations

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Conductive heating and cooling systems for wafer testing at temperature. Its primary use is for wafer testing in Probe Stations, as well as Laser Trim and Wafer Burn-in.

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• -65C to +300°C

• 150mm, 200mm & 300mm

• Retrofits available for existing probe stations