SOLDERING
VADU 200XL
Batch Soldering System Under Vacuum
The VADU 200XL soldering unit is a batch system, designed for both paste and preform soldering. With its two hermetically separated process chambers the system provides precise control of all relevant process parameters, such as temperature gradients during heating and cooling.
Heading 6
VADU 300XL
Efficient Soldering System for Series Production
Designed for high efficient series production with three separate process chambers, internal substrate handling and inline carrier transfer. According to customer requirements the loading or reloading operations can be realized manually or automatically.
VSU28
Tabletop or Stand-Alone Vacuum Reflow System
Infrared lamps from the top and/or the bottom of the tooling plate heats the item up. The tooling plate is 260x210mm and can be customized to orient the substrates/packages.
Process cooling by nitrogen flow that blows from the chamber bottom against the tooling plate.
VSU20
Wafer-Level Bump Reflow System
The vacuum reflow oven is equipped with a wafer holder for up to 200mm wafers. Infrared lamps heat up the wafer from below. Formic acid vapor is used to clean off any metal oxides on the bumps. Cooling is performed via nitrogen.
SINTERING
SIN20
Vacuum Assisted, Small Scale R&D Sintering System SIN20
The SIN20 uses PINK's patented equilibrium-vacuum technology allowing sintering in perfect N2 atmosphere, as well as, in reductive atmosphere like formic acid. Cu substrates, as well as, substrates with a Au or Ag finish can be sintered.
The system can be used with PINK's patented Soft Tool that allows quick change and flexibility, as well as, a hard tool. The flexibility results in short development cycles and minimized cost. Even one-step multi-layer sintering is possible with the Soft Tool.
SIN200+
The Highly Flexible R&D to Production
Sintering System SIN200+
A highly flexible sintering system that is suitable for a wide range of production requirements from the laboratory to series production. It has a modular design that allows it to operate as a batch system or automated inline system with different preheating and/or cooling modules.
The SIN20 uses PINK's patented equilibrium-vacuum technology allowing sintering in perfect N2 atmosphere, as well as, in reductive atmosphere like formic acid. Cu substrates, as well as, substrates with a Au or Ag finish can be sintered.
BOND ANALYSIS
TIFAS IR
Thermal Imaging Failure Analysis System
With the aid of infrared thermography, various defects are detectable in samples, while also being localized and quantified, especially those flaws that directly affect the thermal path. This method is 100% non-destructive and contactless.
With the aid of pulse, pulse-phase and lock-in thermography combined with intelligent image processing, it only takes seconds to reliably evaluate a samples integrity.
