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SOLDERING

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PINK
VADU 100
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Compact Soldering System Under Vacuum​

Designed for operation with paste, as well as preforms. Based on the compact design and the user friendliness, the VADU 100 is very suitable for production of small series and in laboratories for research applications.

VADU 200XL-Modular
VADU200XL-Modular

Batch Soldering System Under Vacuum​

The VADU 200XL-Modular soldering unit is a batch system, designed for both paste and preform soldering. With its two hermetically separated process chambers the system provides precise control of all relevant process parameters, such as temperature gradients during heating and cooling.

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VADU 200XL-W
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Soldering of Substrates and Wafers in Mass Production

Equipped with two separate process chambers this system is designed for both paste and preform soldering. It allows soldering of wafers up to 12 inches.

VADU 300XL/400XL-Modular
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Efficient Soldering System for Series Production

Designed for high efficient series production with three separate process chambers, internal substrate handling and inline carrier transfer. According to customer requirements the loading or reloading operations can be realized manually or automatically.

VADU Modular
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New Modular Design

PINK now offers the proven vacuum soldering systems in a new modern and modular design. The new system is based on modules, which are configured and mounted separately and then are interconnected during final assembly.

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INVACU
VSU28
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Tabletop or Stand-Alone Vacuum Reflow System

Infrared lamps from the top and/or the bottom of the tooling plate heats the item up.  The tooling plate is 260x210mm and can be customized to orient the substrates/packages.

Process cooling by nitrogen flow that blows from the chamber bottom against the tooling plate.

VSU20
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Wafer-Level Bump Reflow System

The vacuum reflow oven is equipped with a wafer holder for up to 200mm wafers.   Infrared lamps heat up the wafer from below.  Formic acid vapor is used to clean off any metal oxides on the bumps.  Cooling is performed via nitrogen.

VSU35
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Stand-Alone Vacuum Reflow System

Infrared lamps placed under the tooling plate and in the lid.  The tooling plate is 320x320mm.  It can also be fabricated with custom pockets for substrates or packages. Nitrogen flow blows from the chamber bottom against the tooling plate to cool it down.

VSU45

Stand-Alone Vacuum Reflow System

Infrared lamps placed under the tooling plate and in the lid.  The tooling plate is 420x420mm and can be fabricated with custom openings for substrates or packages.  Nitrogen flow blows from the chamber bottom against the tooling plate to cool it down. 

SINTERING

Sintering
SIN20
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Vacuum Assisted, Small Scale R&D Sintering System SIN20

The SIN20 uses PINK's patented equilibrium-vacuum technology allowing sintering in perfect N2 atmosphere, as well as, in reductive atmosphere like formic acid.  Cu substrates, as well as, substrates with a Au or Ag finish can be sintered.

The system can be used with PINK's patented Soft Tool that allows quick change and flexibility, as well as, a hard tool.  The flexibility results in short development cycles and minimized cost. Even one-step multi-layer sintering is possible with the Soft Tool.

SIN200+
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The Highly Flexible R&D to Production
Sintering System SIN200+

A highly flexible sintering system that is suitable for a wide range of production requirements from the laboratory to series production. It has a modular design that allows it to operate as a batch system or automated inline system with different preheating and/or cooling modules. 

The SIN20 uses PINK's patented equilibrium-vacuum technology allowing sintering in perfect N2 atmosphere, as well as, in reductive atmosphere like formic acid.  Cu substrates, as well as, substrates with a Au or Ag finish can be sintered.

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