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Backend > Reflow, Soldering, Sintering

SOLDERING

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VADU 100

Compact Soldering System Under Vacuum​

Designed for operation with paste, as well as preforms. Based on the compact design and the user friendliness, the VADU 100 is very suitable for production of small series and in laboratories for research applications.

VADU 200XL

Batch Soldering System Under Vacuum​

The VADU 200XL soldering unit is a batch system, designed for both paste and preform soldering. With its two hermetically separated process chambers the system provides precise control of all relevant process parameters, such as temperature gradients during heating and cooling.

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VADU 200XL-W

Soldering of Substrates and Wafers in Mass Production

Equipped with two separate process chambers this system is designed for both paste and preform soldering. It allows soldering of wafers up to 12 inches.

VADU 300XL

Efficient Soldering System for Series Production

Designed for high efficient series production with three separate process chambers, internal substrate handling and inline carrier transfer. According to customer requirements the loading or reloading operations can be realized manually or automatically.

 
VSU12

Tabletop Vacuum Reflow System

Infrared lamps placed under the tooling plate heat it up.  The tooling plate has a square form with dimensions 100x100mm and can be made out of any suitable material.  It can also be fabricated with custom openings for fixtures.  Tooling plate can be replaced together with the parts on it.  This enables serial production.  Nitrogen flow blows from the chamber bottom against the tooling plate and thus cools it down.  The chamber itself is air cooled.

VSU28

Tabletop or Stand-Alone Vacuum Reflow System

Infrared lamps placed under (or optionally, also above) the tooling plate heats the item up.  The tooling plate is 260x210mm and can be produced in a variety of suitable materials.  It can also be fabricated with custom openings for fixtures.  The design enables loading of the tooling plate inside the chamber together with the parts on it, enabling serial production.

Process cooling by nitrogen flow that blows from the chamber bottom against the tooling plate.  The chamber itself is water cooled.

VSU45

Stand-Alone Vacuum Reflow System

Infrared lamps placed under the tooling plate and in the lid.  The tooling plate has a square form with dimensions 420x420mm and can be made out of any suitable material.  It can also be fabricated with custom openings for fixtures.  Tooling plate can be replaced together with the parts on it.  This enables serial production.  

Nitrogen flow blows from the chamber bottom against the tooling plate and thus cools it down.  The chamber itself is air cooled.

VSU20

Tabletop or Stand-Alone Vacuum Reflow System

The vacuum reflow oven is equipped with a hot plate made of solid aluminum, coated with ceramics.  Another water cooled plate is mounted beneath the hot plate.  At the time of cooling, the cold plate is lifted up and pressed against the hot plate, thus cooling it quickly.  This feature also enables cooling under vacuum.

 

SINTERING

Sinter Technology for Reliable and Temperature-Resistant Sintered Connections

SIN200+

From the Sintering Module SIN200 up to the Optionally Expandable Complete System SIN200+

A highly flexible sintering system that is suitable for a wide range of production requirements from the laboratory to series production. It has a modular design that allows it to operate as a batch system or automated inline system with different preheating and/or cooling modules. 

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Tel: 732-536-3964

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OVER 40 YEARS EXPERIENCE

Located in Central New Jersey, CWI has been representing tier-one equipment suppliers for over 40 years.

PRODUCTS

- Test & Measurement

- Wafer Processing

- Metrology/Inspection

- Backend Operations

- Failure Analysis

VISIT US

704 Ginesi Drive, Suite 11A
Morganville, NJ, 07751

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