Front End Process Equipment Solutions for Universities, R&D, Small, Medium or Global Companies.

From the Basic Steps to the Leading Edge Applications.
Knowledge. Solutions. Support.
Knowledge. Solutions. Support.
Measure Precisely and Find Defects at Blazing Speed.

Metrology & Inspection Solutions for Leading Edge Applications.
Knowledge. Solutions. Support.
Back End Solutions for Standard Applications and the Most Challenging.
......
Die Bonding.
Flip Chip Bonding.
Die to Wafer Bonding.
Wedge/Ball Bonding.
Ribbon Bonding.
Pull & Shear Test.
Test & Measurement Solutions from Wafer to Final Assembly.
       . 
DC.
RF.
High Current.
High Power.
Optical.
Motion Testing.
Knowledge. Solutions. Support.
Knowledge. Solutions. Support.
Find Failures using the Leading Company's Solutions.

Microcleaving.
Laser Trimming.
Acoustic Microscopy.
Decapsulation.
Adaptive Ion Milling.
Advanced Automation Solutions for Any Size Company.

Sorting.

Stocking.

Cleaning.
Knowledge. Solutions. Support.
Back
Next
           
CWI Technical Sales    Phone: 732-536-3964    Fax: 732-536-0495